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62 条记录 (耗时 0.028 秒)

    Semiconductor module socket apparatus
    1.
    发明授权
    Semiconductor module socket apparatus 有权
    半导体模块插座设备

    公开(公告)号：US08587946B2

    公开(公告)日：2013-11-19

    申请号：US12987552

    申请日：2011-01-10

    申请人： Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

    发明人： Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  G06F1/183 ,  H05K7/1431

    摘要： A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

    摘要翻译： 一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。 根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且 实现半导体模块插座装置的无噪声和无振动。

    Test socket for testing electrical characteristics of a memory module
    2.
    发明授权
    Test socket for testing electrical characteristics of a memory module 有权
    用于测试内存模块电气特性的测试插座

    公开(公告)号：US08616907B2

    公开(公告)日：2013-12-31

    申请号：US13165927

    申请日：2011-06-22

    申请人： Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

    发明人： Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

    IPC分类号： H01R13/15

    CPC分类号： H01R12/87 ,  G01R1/0441 ,  H01R2201/20

    摘要： A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

    摘要翻译： 测试插座可以包括插座框架，板，插座销和连接件。 插座框架可以具有配置成接受对象的插槽。 板可以沿着物体的插入方向在槽中自由移动以支撑物体的下表面。 插座销可以沿着与物体的插入方向基本垂直的方向可移动地布置。 插座销可以选择性地与物体的突片接触。 连杆可以枢转地连接到插座销和板。 因此，测试插座的插座销可以避免在插入期间沿着物体的突出部拖动，因此，物体的突片可以避免损坏。

    Semiconductor module, socket for the same, and semiconductor module/socket assembly
    3.
    发明授权
    Semiconductor module, socket for the same, and semiconductor module/socket assembly 有权
    半导体模块，插座相同，以及半导体模块/插座组件

    公开(公告)号：US08385080B2

    公开(公告)日：2013-02-26

    申请号：US13006692

    申请日：2011-01-14

    申请人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    发明人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    IPC分类号： H05K7/00

    CPC分类号： H05K7/00

    摘要： A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

    摘要翻译： 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。

    Test Socket for Testing Electrical Characteristics of a Memory Module
    4.
    发明申请
    Test Socket for Testing Electrical Characteristics of a Memory Module 有权
    用于测试内存模块电气特性的测试插座

    公开(公告)号：US20120007625A1

    公开(公告)日：2012-01-12

    申请号：US13165927

    申请日：2011-06-22

    申请人： Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

    发明人： Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

    IPC分类号： H01R24/00 ,  H01R13/62 ,  G01R1/06

    CPC分类号： H01R12/87 ,  G01R1/0441 ,  H01R2201/20

    摘要： A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

    摘要翻译： 测试插座可以包括插座框架，板，插座销和连接件。 插座框架可以具有配置成接受对象的插槽。 板可以沿着物体的插入方向在槽中自由移动以支撑物体的下表面。 插座销可以沿着与物体的插入方向基本垂直的方向可移动地布置。 插座销可以选择性地与物体的突片接触。 连杆可以枢转地连接到插座销和板。 因此，测试插座的插座销可以避免在插入期间沿着物体的突出部拖动，因此，物体的突片可以避免损坏。

    Protective case for mobile terminal providing real-time vibration feedback
    5.
    发明授权
    Protective case for mobile terminal providing real-time vibration feedback 有权

    公开(公告)号：US10039976B2

    公开(公告)日：2018-08-07

    申请号：US15553485

    申请日：2015-12-11

    申请人： Jung-Hoon Kim

    发明人： Jung-Hoon Kim

    IPC分类号： H04M1/00 ,  H04B1/38 ,  A63F13/285 ,  A45C11/00 ,  A63F13/92 ,  A63F13/98 ,  H04M1/02

    摘要： The present invention relates to a protective case for preventing damage to a mobile terminal, comprising: an actuator (12) comprising a piezoelectric vibrating screen (17) formed by attaching a piezoelectric element layer (20) to at least one side of a substrate (18), at least one or more weight pieces (22) which are fixedly attached to the piezoelectric element layer (20) and increase the vibration force, and a bracket (24) provided so that both ends of the substrate (18) are fixedly attached thereto; an auxiliary battery (10) which supplies power to the actuator (12) and is used for charging in the case where a battery of a mobile terminal (4) is discharged or consumed; and a Bluetooth receiving module (30) for receiving a signal transmitted from a Bluetooth transmitting module (28) of the mobile terminal (4). As the actuator (12), which provides real-time vibration feedback, is installed in the inner side of the protective case (2)(2a) which is worn for preventing damage to the mobile terminal (4), the protective case has an effect of giving a user simultaneous sensory stimulation by providing the user with a haptic signal corresponding to an image and sound outputted from the mobile terminal (4) as a rapid vibration response. In addition, the protective case can transfer various vibration patterns including strong vibration and micro vibration as the vibration amount of the actuator (12) is adjusted according to the magnitude of vibration, or a vibration motor (14) is controlled so as to provide vibration feedback at low frequency, and thus, the protective case has an effect of giving the user a sense of realism.

    Connection Module For Portable Device
    10.
    发明申请
    Connection Module For Portable Device 有权
    便携式设备连接模块

    公开(公告)号：US20120231671A1

    公开(公告)日：2012-09-13

    申请号：US13414160

    申请日：2012-03-07

    申请人： Jung-Hoon Kim

    发明人： Jung-Hoon Kim

    IPC分类号： H01R24/68

    CPC分类号： H01R24/60 ,  H01R12/716 ,  H01R27/02

    摘要： A connection module for a portable device having a reduced thickness and a slimmer shape. The connection module includes a case, an upper plug connection terminal unit, and a lower plug connection terminal unit. The case includes an upper portion and a lower portion. The upper plug connection terminal unit includes a plurality of upper connection terminals disposed along the upper portion. The lower plug connection terminal unit includes a plurality of lower connection terminals disposed along the lower portion. The plurality of lower connection terminals are spaced apart from the plurality of upper connection terminals and alternately arranged at staggered positions such that the plurality of upper and lower connection terminals engage each other when positioned on a same plane.

    摘要翻译： 一种用于便携式设备的连接模块，其具有减小的厚度和更细的形状。 连接模块包括壳体，上部插头连接端子单元和下部插头连接端子单元。 壳体包括上部和下部。 上插头连接端子单元包括沿着上部布置的多个上连接端子。 下插头连接端子单元包括沿着下部布置的多个下连接端子。 多个下连接端子与多个上连接端子间隔开，并且交替布置在交错位置，使得当定位在同一平面上时，多个上连接端子和下连接端子彼此接合。