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公开(公告)号:US20110111536A1
公开(公告)日:2011-05-12
申请号:US13002573
申请日:2009-06-10
IPC分类号: H01L33/64
CPC分类号: F21V29/70 , F21K9/00 , F21K9/20 , F21S2/005 , F21V19/004 , F21V29/507 , F21V29/74 , F21Y2105/10 , F21Y2115/10
摘要: A method of mounting a light emitting diode (LED) module (100) to a heat sink (102), the method comprising the steps of placing the LED module (100) in a hole (120) in the heat sink (102); and expanding a portion of the LED module (100) such that the LED module (100) is secured to the heat sink (102). The method provides a cost efficient way of securing an LED module to a heat sink where the mount has a high reliability over time.
摘要翻译: 一种将发光二极管(LED)模块(100)安装到散热器(102)的方法,所述方法包括以下步骤:将LED模块(100)放置在散热器(102)中的孔(120)中; 以及扩展所述LED模块(100)的一部分,使得所述LED模块(100)固定到所述散热器(102)。 该方法提供了将LED模块固定到散热器的成本有效的方式,其中安装件随着时间具有高可靠性。
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公开(公告)号:US08492179B2
公开(公告)日:2013-07-23
申请号:US13002573
申请日:2009-06-10
IPC分类号: H01L21/00
CPC分类号: F21V29/70 , F21K9/00 , F21K9/20 , F21S2/005 , F21V19/004 , F21V29/507 , F21V29/74 , F21Y2105/10 , F21Y2115/10
摘要: A method of mounting a light emitting diode (LED) module (100) to a heat sink (102), the method comprising the steps of placing the LED module (100) in a hole (120) in the heat sink (102); and expanding a portion of the LED module (100) such that the LED module (100) is secured to the heat sink (102). The method provides a cost efficient way of securing an LED module to a heat sink where the mount has a high reliability over time.
摘要翻译: 一种将发光二极管(LED)模块(100)安装到散热器(102)的方法,所述方法包括以下步骤:将LED模块(100)放置在散热器(102)中的孔(120)中; 以及扩展所述LED模块(100)的一部分,使得所述LED模块(100)固定到所述散热器(102)。 该方法提供了将LED模块固定到散热器的成本有效的方式,其中安装件随着时间具有高可靠性。
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