公开(公告)号：US06407006B1

公开(公告)日：2002-06-18

申请号：US09549659

申请日：2000-04-14

申请人： Joseph A Levert ,  Daniel Lynne Towery ,  Denis Endisch

发明人： Joseph A Levert ,  Daniel Lynne Towery ,  Denis Endisch

IPC分类号： H01L2131

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/31051

摘要： An apparatus for planarizing or patterning a dielectric film on a substrate is provided. The apparatus includes a press for applying contact pressure to an operably connected compression tool. The compression tool has a working face that is planar or patterned. A controller for regulating the position, timing and force applied by the compression tool to the dielectric film is also provided. There is also provided a support, with an optional workpiece holder for supporting the substrate and dielectric film during contact with the compression tool. Methods of using the apparatus, as well as planarized and/or patterned dielectric films are also provided.

摘要翻译： 提供了一种用于平坦化或图案化基板上的电介质膜的装置。 该装置包括用于向可操作地连接的压缩工具施加接触压力的压力机。 压缩工具具有平面或图案化的工作面。 还提供了一种用于调节压缩工具对电介质膜施加的位置，正时和力的控制器。 还提供了支撑件，其具有用于在与压缩工具接触期间支撑基板和电介质膜的可选的工件保持器。 还提供了使用该装置的方法，以及平面化和/或图案化的电介质膜。