公开(公告)号：US07011143B2

公开(公告)日：2006-03-14

申请号：US10838669

申请日：2004-05-04

申请人： Joseph P. Corrado ,  John F. Eberth ,  Steven J. Mazzuca ,  Roger R. Schmidt ,  Takeshi Tsukamoto

发明人： Joseph P. Corrado ,  John F. Eberth ,  Steven J. Mazzuca ,  Roger R. Schmidt ,  Takeshi Tsukamoto

IPC分类号： F28F7/00

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20645 ,  H05K7/20781

摘要： A modular fluid unit for cooling heat sources located on a rack, the modular fluid unit comprising: a heat exchanger in fluid communication a pump; and wherein the modular fluid unit is mountable within the rack and is configurable to be in fluid communication with a cold plate return manifold, a cold plate supply manifold, and an end-user fluid supply. A method for cooling electronic components in a rack, the method comprising: circulating a first liquid from a cold plate to one of a plurality of heat exchangers mounted within the rack; circulating a second liquid from a second liquid supply to the one of a plurality of heat exchangers; and transferring heat from the first liquid to the second liquid at the one of a plurality of heat exchangers.

摘要翻译： 一种用于冷却位于机架上的热源的模块化流体单元，所述模块化流体单元包括：流体连通泵的热交换器; 并且其中所述模块化流体单元可安装在所述齿条内并且可配置为与冷板返回歧管，冷板供给歧管和终端用户流体供应源流体连通。 一种用于冷却机架中的电子部件的方法，所述方法包括：将第一液体从冷板循环到安装在所述齿条内的多个热交换器中的一个; 将第二液体从第二液体供应循环到多个热交换器中的一个; 以及在多个热交换器中的一个处将热量从第一液体传递到第二液体。