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    RF/microwave high power switching combiner unit
    2.
    发明授权
    RF/microwave high power switching combiner unit 有权
    射频/微波大功率开关组合器单元

    公开(公告)号：US09503034B2

    公开(公告)日：2016-11-22

    申请号：US14691422

    申请日：2015-04-20

    申请人： DAICO INDUSTRIES, INC.

    发明人： Eddie Blair

    IPC分类号： H01P1/10 ,  H03F3/19 ,  H01L23/373 ,  H01L23/473 ,  H03F1/02 ,  H03F3/21 ,  H03H7/38 ,  H03F1/52 ,  H03F3/195 ,  H03F3/60 ,  H01P5/16 ,  H01P1/15 ,  H03F3/68

    CPC分类号： H03F3/19 ,  A61K48/00 ,  H01L23/373 ,  H01L23/473 ,  H01L2924/0002 ,  H01P5/16 ,  H03F1/0205 ,  H03F1/0211 ,  H03F1/0222 ,  H03F1/0277 ,  H03F1/526 ,  H03F3/195 ,  H03F3/211 ,  H03F3/602 ,  H03F3/68 ,  H03F2200/447 ,  H03F2200/451 ,  H03F2203/21106 ,  H03F2203/21142 ,  H03F2203/21145 ,  H03H7/383 ,  H05K7/20 ,  H05K7/20636 ,  H05K7/20645 ,  H05K7/209 ,  H05K7/20927 ,  H01L2924/00

    摘要： A switching combiner unit (SCU) may combine coherent RF or microwave outputs from multiple power amplifier units (PAUs). Each SCU may be able to be switched between an on-line mode (on-line PAU), during which the PAU amplifies a coherent instance of the same RF or microwave input signal and delivers that amplified input signal to an output, and a standby or off-line mode (standby/off-line PAU), during which the PAU does not amplify an instance of the same RF or microwave input signal or deliver an amplified input signal to the output. The SCU may include an input port that connects to each of the PAU outputs; a control signal input that receives one or more control signals that indicate whether each PAU is in the on-line or standby/off-line mode; signal combining circuitry that coherently sums the outputs from all of the on-line PAUs, while simultaneously isolating the standby/off-line PAUs from the output of the SCU and the outputs of the on-line PAUs; and an SCU output port that delivers the coherently summed outputs from all of the on-line PAUs.

    摘要翻译： 开关组合器单元（SCU）可以组合来自多个功率放大器单元（PAU）的相干RF或微波输出。 每个SCU可能能够在在线模式（在线PAU）之间切换，在该模式期间，PAU放大相同RF或微波输入信号的相干实例，并将该放大的输入信号传送到输出端，并且备用 或离线模式（待机/离线PAU），在此期间PAU不会放大相同RF或微波输入信号的实例或将放大的输入信号传送到输出。 SCU可以包括连接到每个PAU输出的输入端口; 控制信号输入，其接收指示每个PAU是处于在线还是待机/离线模式的一个或多个控制信号; 信号组合电路，其将来自所有在线PAU的输出相加地相加，同时将备用/离线PAU与SCU的输出和在线PAU的输出隔离; 以及一个SCU输出端口，用于传送所有在线PAU的相干相加输出。

    Electronics enclosures with high thermal performance and related system
    4.
    发明授权
    Electronics enclosures with high thermal performance and related system 有权
    具有高热性能和相关系统的电子外壳

    公开(公告)号：US09107293B2

    公开(公告)日：2015-08-11

    申请号：US13469798

    申请日：2012-05-11

    申请人： Bruce C. Fitz-Patrick ,  Gary A. Clayton ,  Byron E. Short, Jr.

    发明人： Bruce C. Fitz-Patrick ,  Gary A. Clayton ,  Byron E. Short, Jr.

    IPC分类号： H05K7/20 ,  H05K5/02 ,  B22D25/02 ,  B22D19/00 ,  B22D19/04

    CPC分类号： H05K5/02 ,  B22D19/0072 ,  B22D19/04 ,  B22D25/02 ,  H05K7/20636 ,  H05K7/20645

    摘要： Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within the electronics enclosure. Each fluid transport structure includes multiple pipes and multiple flow channels. The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. The fluid transport structure(s) and the electronics enclosure are formed from different materials. The at least one fluid transport structure can be resistant to corrosion caused by the cooling fluid, and the electronics enclosure can be susceptible to corrosion caused by the cooling fluid. As an example, the at least one fluid transport structure could consist essentially of nickel, and the electronics enclosure could consist essentially of aluminum.

    摘要翻译： 提供了用于冷却电子部件的各种装置，方法和系统。 例如，一种装置包括具有配置成分离电子部件的多个肋的电子设备外壳。 该装置还包括封装在电子外壳内的至少一个流体输送结构。 每个流体输送结构包括多个管道和多个流动通道。 流动通道位于电子设备外壳的肋内，并且管道被配置为将冷却流体输送到流动通道和从流动通道传送冷却流体。 流体输送结构和电子外壳由不同的材料形成。 至少一个流体输送结构可以抵抗由冷却流体引起的腐蚀，并且电子外壳可能容易受到冷却流体引起的腐蚀。 作为示例，至少一个流体输送结构可以主要由镍组成，并且电子外壳可以基本由铝组成。

    ELECTRONICS CABINET AND RACK COOLING SYSTEM AND METHOD
    6.
    发明申请
    ELECTRONICS CABINET AND RACK COOLING SYSTEM AND METHOD 审中-公开
    电子柜和机架冷却系统及方法

    公开(公告)号：US20130213075A1

    公开(公告)日：2013-08-22

    申请号：US13772606

    申请日：2013-02-21

    申请人： Thermal Corp.

    发明人： W. John Bilski

    IPC分类号： F25D31/00

    CPC分类号： F25D31/00 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H05K7/20645

    摘要： A thermal management system for a electronics cabinets having an electronics heat source therein. The thermal management system includes a first passive thermal device having an evaporator portion and a condenser portion. The thermal management system can also include a heat sink in contact with air inside the cabinet and in thermal contact with the evaporator portion of the first passive thermal device, wherein the heat sink is contained within the sealed cabinet. The condenser portion of the first passive thermal device can be in contact with a liquid to liquid heat exchanger.

    摘要翻译： 一种用于其中具有电子热源的电子柜的热管理系统。 热管理系统包括具有蒸发器部分和冷凝器部分的第一无源热装置。 热管理系统还可以包括与机柜内部的空气接触并与第一被动热设备的蒸发器部分热接触的散热器，其中散热器容纳在密封的柜内。 第一被动热装置的冷凝器部分可以与液体与液体热交换器接触。

    Aircraft signal computer system having a plurality of modular signal computer units
    7.
    发明授权
    Aircraft signal computer system having a plurality of modular signal computer units 有权
    具有多个模块化信号计算机单元的飞行器信号计算机系统

    公开(公告)号：US08508934B2

    公开(公告)日：2013-08-13

    申请号：US13059528

    申请日：2009-08-13

    申请人： Sebastian Roering

    发明人： Sebastian Roering

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20645 ,  G06F1/20 ,  G06F2200/201

    摘要： An aircraft signal computer system includes a plurality of modular signal computer units and a liquid cooling device for cooling the modular signal computer units. The liquid cooling device includes a coolant line, which is connectable to a central liquid cooling system of an aircraft in order to supply a liquid coolant medium at a desired low temperature to the liquid cooling device. The coolant line of the liquid cooling device is in thermal surface contact with the modular signal computer units in order to dissipate heat from the modular signal computer units. A heat-emitting component of the modular signal computer units may be in thermal contact with a coolant bath or an internal heat conductor for removing heat energy.

    摘要翻译： 飞行器信号计算机系统包括多个模块化信号计算机单元和用于冷却模块化信号计算机单元的液体冷却装置。 液体冷却装置包括冷却剂管线，冷却剂管线可连接到飞行器的中央液体冷却系统，以便将液体冷却剂介质以期望的低温供应到液体冷却装置。 液体冷却装置的冷却剂管线与模块化信号计算机单元热表面接触以便散发来自模块化信号计算机单元的热量。 模块化信号计算机单元的发热部件可以与冷却剂浴或用于去除热能的内部热导体热接触。

    Cooled Universal Hardware Platform
    8.
    发明申请
    Cooled Universal Hardware Platform 有权
    冷却通用硬件平台

    公开(公告)号：US20130194750A1

    公开(公告)日：2013-08-01

    申请号：US13776340

    申请日：2013-02-25

    申请人： Birchbridge Incorporated

    发明人： John Craig Dunwoody ,  Teresa Ann Dunwoody

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20781 ,  H05K7/20645

    摘要： Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

    摘要翻译： 公开了一种机架系统的实施例，其包括具有框架的冷却通用硬件平台，在机架系统的第一侧上的模块插入区域和与第一侧相对的机架系统的第二侧上的通用背板安装区域， 电源总线，多个冷却隔板，多个模块隔间，两个或更多个服务单元背板和冷却剂源。 电源总线可以被配置为向通用背板安装区域和多个冷却隔板提供电力。 机架系统还可以包括可以被配置为在机架系统内具有不同功能的多个服务单元。

    Cooled universal hardware platform
    9.
    发明授权
    Cooled universal hardware platform 失效

    公开(公告)号：US08411440B2

    公开(公告)日：2013-04-02

    申请号：US12840824

    申请日：2010-07-21

    申请人： John Craig Dunwoody ,  Teresa Ann Dunwoody

    发明人： John Craig Dunwoody ,  Teresa Ann Dunwoody

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H05K7/20781 ,  H05K7/20645

    摘要： Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.