公开(公告)号：US20170117198A1

公开(公告)日：2017-04-27

申请号：US15298919

申请日：2016-10-20

申请人： Joung-Yeal KIM ,  Dae-Hyun KWON ,  Mi-Young WOO ,  Joon-Sun YOON ,  Jong-Hyun CHOI

发明人： Joung-Yeal KIM ,  Dae-Hyun KWON ,  Mi-Young WOO ,  Joon-Sun YOON ,  Jong-Hyun CHOI

IPC分类号： H01L21/66 ,  H01L49/02 ,  H01L23/498 ,  H01L27/08

CPC分类号： H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L27/0802 ,  H01L28/20

摘要： A semiconductor device may include a first terminal electrically connected to a first semiconductor chip, a second terminal electrically connected to a second semiconductor chip, which is different from the first semiconductor chip, a first signal line electrically connecting the first terminal and the second terminal and including a first node, a third terminal connected to a tester monitoring a signal transmitted between the first semiconductor chip and the second semiconductor chip, a fourth terminal applied a reference voltage, a second signal line electrically connecting the third terminal and the fourth terminal and including a second node, a first resistor connected between the first node and the second node and a second resistor directly connected to the second node different from the first resistor.