公开(公告)号：US06445206B1

公开(公告)日：2002-09-03

申请号：US09583936

申请日：2000-05-31

申请人： Juan Ignacio Alonso Montull ,  Carlos Ortega ,  Eliseo Ventura Sobrino Patino

发明人： Juan Ignacio Alonso Montull ,  Carlos Ortega ,  Eliseo Ventura Sobrino Patino

IPC分类号： G01R3126

CPC分类号： G01R31/2831

摘要： A method for processing semiconductor wafers includes forming a plurality of wafers each comprising a plurality of dies, performing a plurality of tests on the dies to determine good dies and failed dies, and packaging the good dies. The tests are performed on the good dies after packaging to determine good packaged dies and failed packaged dies. A determination is made as to which tests indicate both failed dies and failed packaged dies so that corrective action may be taken. A database is formed to include test data collected at wafer level on dies before they are packaged, and test data collected at package level after the good dies have been packaged. The database and the results of the test comparisons are made available via the Internet so that other facilities processing the same type devices can review and compare the information to their own data. A global or worldwide monitoring of the test data is thus made available.

摘要翻译： 一种用于处理半导体晶片的方法包括形成多个晶片，每个晶片包括多个模具，对模具执行多个测试以确定良好的模具和失效的模具，以及封装良好的模具。 测试在包装后在良好的模具上进行，以确定良好的包装模具和失效的包装模具。 确定哪个测试表明失败的模具和失败的包装模具，以便可以采取纠正措施。 数据库被形成为包括在芯片封装之前在晶片级收集的测试数据，以及在封装好的裸片之后在封装级别收集的测试数据。 数据库和测试比较结果可通过互联网获得，以便处理相同类型设备的其他设施可以查看和比较信息与自己的数据。 因此，可以对全球或全球的测试数据进行监控。