公开(公告)号：US20220281132A1

公开(公告)日：2022-09-08

申请号：US17193112

申请日：2021-03-05

Applicant: Juan Wood Building Materials Co., Ltd.

Inventor： Yu-Che Huang

IPC: B27M1/08 ,  B32B21/10 ,  B32B5/02 ,  B32B7/12 ,  B32B21/14 ,  B32B38/00 ,  B27D5/00

Abstract: A method of making a wooden board assembly includes A) determining a scrap portion of a trunk; B) cutting the trunk horizontally to form multiple boards; C) removing narrow scraps and trimmed sections of each of the multiple boards to obtain multiple trimmed wide boards, and cutting narrow board areas from the scrap portion to form multiple peripheral boards; D) removing a part of the scrap portion and two trimmed sections from each of the multiple peripheral boards; E) connecting the multiple trimmed wide boards and the multiple peripheral boards to form a substrate; F) adhering two straps on the substrate to produce a wood pattern assembly; G) cutting the wood pattern assembly to form multiple cut films; H) adhering one of the multiple cut films with a nonwoven fabric with a transparent adhesive and connecting the multiple cut films on a fixing lamination; and I) cutting the fixing lamination.

公开(公告)号：US11440215B1

公开(公告)日：2022-09-13

申请号：US17193112

申请日：2021-03-05

Applicant: Juan Wood Building Materials Co., Ltd.

Inventor： Yu-Che Huang

IPC: B27M1/08 ,  B32B21/00 ,  B32B5/00 ,  B32B7/00 ,  B27D5/00 ,  B32B38/00 ,  B32B21/10 ,  B32B5/02 ,  B32B7/12 ,  B32B21/14

Abstract: A method of making a wooden board assembly includes A) determining a scrap portion of a trunk; B) cutting the trunk horizontally to form multiple boards; C) removing narrow scraps and trimmed sections of each of the multiple boards to obtain multiple trimmed wide boards, and cutting narrow board areas from the scrap portion to form multiple peripheral boards; D) removing a part of the scrap portion and two trimmed sections from each of the multiple peripheral boards; E) connecting the multiple trimmed wide boards and the multiple peripheral boards to form a substrate; F) adhering two straps on the substrate to produce a wood pattern assembly; G) cutting the wood pattern assembly to form multiple cut films; H) adhering one of the multiple cut films with a nonwoven fabric with a transparent adhesive and connecting the multiple cut films on a fixing lamination; and I) cutting the fixing lamination.