公开(公告)号：US6083633A

公开(公告)日：2000-07-04

申请号：US877020

申请日：1997-06-16

申请人： Julius C. Fister ,  Szuchain F. Chen ,  Christoper P. Laurello ,  Arvind Parthasarathi ,  Derek E. Tyler

发明人： Julius C. Fister ,  Szuchain F. Chen ,  Christoper P. Laurello ,  Arvind Parthasarathi ,  Derek E. Tyler

IPC分类号： B32B15/01 ,  H05K3/24

CPC分类号： H05K3/244 ,  B32B15/01 ,  Y10S428/926 ,  Y10S428/929 ,  Y10T428/12493 ,  Y10T428/12632 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12917

摘要： An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ("y") of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.

摘要翻译： 电导体具有涂覆有锡基涂层的铜基底。 为了抑制铜/锡金属间化合物的形成以及作为氧化和腐蚀屏障使用的游离的未反应的锡的消耗，衬底和涂层之间插入有阻挡层。 在第一实施例中，屏障由多个构成层形成，其中至少一个是铜。 铜层的厚度（“y”）取决于预期的使用温度，满足等式y =（ - 1.52 + 0.0871x + 0.00859 t）+/- 50％，其中t =使用温度下的预期时间，x =预期使用温度（摄氏度），y =微米级铜层的厚度。 在第二实施例中，阻挡层由一个或多个构成层形成，其中至少一个是铁或铁基。