公开(公告)号：US20080170190A1

公开(公告)日：2008-07-17

申请号：US11622664

申请日：2007-01-12

申请人： Jung-Huang Lan ,  Yih-Shing Lee ,  Cheng-Hsin Chen ,  Hsxg-Ju Sung

发明人： Jung-Huang Lan ,  Yih-Shing Lee ,  Cheng-Hsin Chen ,  Hsxg-Ju Sung

IPC分类号： G02F1/1333

CPC分类号： G02F1/1345 ,  G02F1/1341

摘要： A system for displaying images is disclosed. A display panel comprises a first substrate and a second substrate with a liquid crystal layer interposed therebetween. A sealant is interposed between the first substrate and a second substrate for sealing the liquid crystal layer. A dielectric layer is overlying the first substrate. Metal lines are overlying the dielectric layer under and/or near the sealant. A planarization layer covers and contacts the dielectric layer and the metal lines to form a first interface between the metal lines and the planarization layer and a second interface between the dielectric layer and the planarization layer. Bridge lines without contacting the planarization layer are disposed under and/or near the sealant, instead of at least a portion of the metal lines contacting the planarization layer.

摘要翻译： 公开了一种用于显示图像的系统。 显示面板包括第一基板和介于其间的液晶层的第二基板。 在第一基板和用于密封液晶层的第二基板之间插入密封剂。 电介质层覆盖在第一衬底上。 金属线覆盖在密封剂之下和/或附近的介电层。 平坦化层覆盖并接触电介质层和金属线，以在金属线和平坦化层之间形成第一界面，以及介电层和平坦化层之间的第二界面。 不接触平坦化层的桥接线布置在密封剂的下面和/或附近，而不是金属线的至少一部分接触平坦化层。

公开(公告)号：US08138549B2

公开(公告)日：2012-03-20

申请号：US11622664

申请日：2007-01-12

申请人： Jung-Huang Lan ,  Yih-Shing Lee ,  Cheng-Hsin Chen ,  Hsxg-Ju Sung

发明人： Jung-Huang Lan ,  Yih-Shing Lee ,  Cheng-Hsin Chen ,  Hsxg-Ju Sung

IPC分类号： H01L23/62

CPC分类号： G02F1/1345 ,  G02F1/1341

摘要： A system for displaying images is disclosed. A display panel comprises a first substrate and a second substrate with a liquid crystal layer interposed therebetween. A sealant is interposed between the first substrate and a second substrate for sealing the liquid crystal layer. A dielectric layer is overlying the first substrate. Metal lines are overlying the dielectric layer under and/or near the sealant. A planarization layer covers and contacts the dielectric layer and the metal lines to form a first interface between the metal lines and the planarization layer and a second interface between the dielectric layer and the planarization layer. Bridge lines without contacting the planarization layer are disposed under and/or near the sealant, instead of at least a portion of the metal lines contacting the planarization layer.

摘要翻译： 公开了一种用于显示图像的系统。 显示面板包括第一基板和介于其间的液晶层的第二基板。 在第一基板和用于密封液晶层的第二基板之间插入密封剂。 电介质层覆盖在第一衬底上。 金属线覆盖在密封剂之下和/或附近的介电层。 平坦化层覆盖并接触电介质层和金属线，以在金属线和平坦化层之间形成第一界面，以及介电层和平坦化层之间的第二界面。 不接触平坦化层的桥接线布置在密封剂的下面和/或附近，而不是金属线的至少一部分接触平坦化层。

公开(公告)号：US06431687B1

公开(公告)日：2002-08-13

申请号：US09813599

申请日：2001-03-20

申请人： Dong-Sing Wuu ,  Chen-Yu Cheng ,  Je-Ping Hu ,  Yi-Yung Wu ,  Yih-Shing Lee

发明人： Dong-Sing Wuu ,  Chen-Yu Cheng ,  Je-Ping Hu ,  Yi-Yung Wu ,  Yih-Shing Lee

IPC分类号： B41J205

CPC分类号： B41J2/1643 ,  B41J2/14112 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/1437 ,  B41J2002/14403

摘要： A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.

摘要翻译： 单片集成热气泡喷墨打印头的制造方法及其结构。 该方法利用半导体制造技术在单个衬底上的热气泡喷墨打印头中配置各种元件，例如墨水通道，墨槽，能量换能器，孔板。 使用各向异性蚀刻技术在基板的顶表面上形成墨通道。 使用各向异性蚀刻技术在基板的背面上形成墨槽。 使用涂覆和蚀刻技术，能量换能器和孔板按顺序形成在油墨通道上方。 该热气泡喷墨打印头的制造方法在采用常规喷墨打印头中的孔板的精密对准接头的步骤中，在所有分批处理中特别有用。 因此，该方法可大大提高生产效率，降低生产成本。