摘要:
A method of fabricating a semiconductor memory device having a self-aligned electrode is provided. An interlayer insulating layer having a contact hole is formed on a substrate. A phase change pattern partially filling the contact hole is formed. A bit line which includes a bit extension self-aligned to the phase change pattern and crosses over the interlayer insulating layer is formed. The bit extension may extend in the contact hole on the phase change pattern. The bit extension contacts the phase change pattern.
摘要:
A semiconductor device employing a transistor having a recessed channel region and a method of fabricating the same is disclosed. A semiconductor substrate has an active region. A trench structure is defined within the active region. The trench structure includes an upper trench region adjacent to a surface of the active region, a lower trench region and a buffer trench region interposed between the upper trench region and the lower trench region. A width of the lower trench region may be greater than a width of the upper trench region. An inner wall of the trench structure may include a convex region interposed between the upper trench region and the buffer trench region and another convex region interposed between the buffer trench region and the lower trench region. A gate electrode is disposed in the trench structure. A gate dielectric layer is interposed between the gate electrode and the trench structure.