公开(公告)号：US08094922B2

公开(公告)日：2012-01-10

申请号：US12476874

申请日：2009-06-02

申请人： Jung-Ju Lee ,  Won-Seock Kim

发明人： Jung-Ju Lee ,  Won-Seock Kim

IPC分类号： G06K9/00

CPC分类号： G01B11/2518 ,  G06T7/521

摘要： Disclosed are a crack measuring method that may automatically measure crack growth in a surface of a structure rapidly and exactly without influencing the structure using image processing scheme, and an apparatus thereof. The crack measuring method includes: irradiating light to a surface of a structure; converting reflected light, wherein the irradiated light is reflected from the surface of a structure, into an image signal and capturing images of the surface of a structure corresponding to the image signal at predetermined scan intervals through a camera; performing continuously a line scan on the crack parts in the captured images at predetermined scan intervals; and inspecting crack growth in the surface of a structure by identifying pixels with relatively higher or lower light intensity in the scan lines.

摘要翻译： 公开了一种裂纹测量方法，其可以快速准确地自动测量结构表面中的裂纹扩展，而不影响使用图像处理方案的结构及其装置。 裂纹测量方法包括：将光照射到结构的表面; 将经照射的光从结构的表面反射的反射光转换为图像信号，并通过相机以预定的扫描间隔拍摄与图像信号对应的结构的表面的图像; 以预定的扫描间隔连续对捕获的图像中的裂纹部分进行线扫描; 并且通过在扫描线中识别具有相对较高或较低光强度的像素来检查结构表面中的裂纹扩展。