Thermoplastic resin composition with high impact strength at low
temperatures
    1.
    发明授权
    Thermoplastic resin composition with high impact strength at low temperatures 失效
    低温冲击强度高的热塑性树脂组合物

    公开(公告)号:US5965666A

    公开(公告)日:1999-10-12

    申请号:US26744

    申请日:1998-02-20

    IPC分类号: C08L55/02 C08L77/00 C08G63/48

    CPC分类号: C08L55/02 C08L77/00

    摘要: This invention relates to a resin composition having high impact strength at low temperatures, comprising a polyamide, a graft copolymer obtained by graft polymerizing a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer to a conjugated diene rubber, a copolymer comprising an aromatic vinyl monomer, a vinyl cyanide monomer and other vinyl monomer copolymerizable with the aromatic vinyl monomer and the vinyl cyanide monomer, a modified hydrogenated block copolymer comprising a conjugated diene rubber and styrene or its derivatives to which has been grafted an unsaturated carboxylic acid or an unsaturated carboxylic anhydride, a copolymer comprising an aromatic vinyl monomer, a maleimide monomer, an unsaturated carboxylic acid or an unsaturated carboxylic anhydride, and other vinyl monomer copolymerizable with the aromatic vinyl monomer, and a graft copolymer obtained by graft polymerizing a maleic anhydride to an ethylene-propylene rubber.

    摘要翻译: 本发明涉及一种在低温下具有高冲击强度的树脂组合物,其包含聚酰胺,通过将芳族乙烯基单体和乙烯基氰单体的单体混合物接枝聚合到共轭二烯橡胶上得到的接枝共聚物,包含芳香族 乙烯基单体,乙烯基氰单体和可与芳族乙烯基单体和乙烯基氰单体共聚的其它乙烯基单体,包含共轭二烯橡胶和苯乙烯或其衍生物的改性氢化嵌段共聚物,其已经接枝不饱和羧酸或不饱和羧酸 羧酸酐,包含芳族乙烯基单体,马来酰亚胺单体,不饱和羧酸或不饱和羧酸酐的共聚物和可与芳族乙烯基单体共聚的其它乙烯基单体的共聚物,以及通过将马来酸酐接枝聚合到乙烯 丙烯橡胶。