公开(公告)号：US20230117510A1

公开(公告)日：2023-04-20

申请号：US17768063

申请日：2020-06-25

申请人： Junghoon LEE ,  Samsung Electronics Co., Ltd.

发明人： Raehong CHO ,  Jaesung LEE ,  Junghoon LEE ,  Geunwoo PARK ,  Jeongmin PARK

IPC分类号： C09D161/02 ,  H05K3/28 ,  C09D123/08 ,  C09D7/20

摘要： The present disclosure provides a protective coating composition for circuit boards, the composition capable of i) forming a protective coating for effectively protecting a circuit board and an electrical/electronic component mounted thereon, from moisture, foreign materials, and corrosive gas, ii) reducing the formation time of a protective coating, iii) forming a protective coating capable of achieving optimal protective performance with a smaller thickness, and iv) forming a protective coating that is easier to remove. According to one aspect of the present disclosure, an embodiment of the protective coating composition for circuit boards includes a polyketone, and a solvent.