公开(公告)号：US4240099A

公开(公告)日：1980-12-16

申请号：US019607

申请日：1979-03-12

申请人： Jurgen Brandt ,  Ludwig Herold ,  Wolfgang Pikorz ,  Alois Sonntag

发明人： Jurgen Brandt ,  Ludwig Herold ,  Wolfgang Pikorz ,  Alois Sonntag

IPC分类号： H01L23/04 ,  H01L23/051 ,  H01L23/42 ,  H01L23/44 ,  H01L23/46

CPC分类号： H01L23/051 ,  H01L24/01 ,  H01L2924/1301 ,  H01L2924/351

摘要： A high performance, wafer-shaped semiconductor device of the type including a wafer-shaped semiconductor element, a pair of electrodes located on the surfaces of the element, a pair of cylindrical metal bodies contacting the electrodes, an insulating ring enclosing and centering the metal bodies and the semiconductor element and a plastic jacket surrounding the insulating ring for tightly encasing the semiconductor device. In addition, there is provided a pair of annular sheet metal strips each of which has an inner edge region fastened to one of the cylindrical metal bodies and a corrugated chemically roughened outer edge region which is embedded in the plastic jacket. A powder coating is applied to the chemically roughened outer edge region for the purpose of providing a pressure and oil-tight housing for the semiconductor device.

摘要翻译： 一种高性能晶片形半导体器件，其类型包括晶片状半导体元件，位于元件表面上的一对电极，与电极接触的一对圆柱形金属体，围绕金属的绝缘环 主体和半导体元件以及围绕绝缘环的塑料护套，用于紧密地封装半导体器件。 另外，还提供了一对环状的金属板条，每一个都具有固定在其中一个圆柱形金属体上的内边缘区域和嵌入塑料外壳中的瓦楞化学粗糙化的外边缘区域。 为了提供用于半导体器件的压力和油密封的外壳，将粉末涂层施加到化学粗糙化的外边缘区域。

公开(公告)号：US3986201A

公开(公告)日：1976-10-12

申请号：US536211

申请日：1974-12-24

申请人： Ludwig Herold ,  Wolfgang Pikorz ,  Alois Sonntag

发明人： Ludwig Herold ,  Wolfgang Pikorz ,  Alois Sonntag

IPC分类号： H01L23/04 ,  H01L23/051 ,  H01L23/28 ,  H01L23/02 ,  H01L23/42 ,  H01L23/44

CPC分类号： H01L23/051 ,  H01L24/01 ,  H01L2924/1301 ,  H01L2924/351

摘要： A high output semiconductor device of the type which is tightly encased in a plastic coating, and includes a wafer-shaped semiconductor body having electrodes at its opposed major surfaces, two cylindrical metal bodies serving as current connecting and heat dissipating members contacting the electrodes of the semiconductor body at the respective major surfaces, and an insulating ring which encloses the metal bodies and the semiconductor body thereby centering the same. A pair of annular sheet metal strips, each having a dished portion adjacent the inner periphery, are each fastened at their inner peripheries to the superficies of a respective one of the two metal bodies. The dished portion of each of the annular strips encloses one frontal face or edge surface of the insulating ring while leaving an air gap therebetween and the outer edge portion of each annular strip extends into and is rigidly embedded in the plastic coating which has been produced by encasing or spraying under pressure around the outer surface of the insulating ring. The insulating ring is made of a material which does not adhere to the metal bodies or the annular strips and has a high softening temperature.

摘要翻译： 一种高密度地封装在塑料涂层中的高输出半导体器件，包括在其相对的主表面上具有电极的晶片状半导体本体，两个圆柱形金属体，用作与电极连接的电流连接和散热构件 半导体主体，以及包围金属体和半导体本体的绝缘环，从而使其对准。 每个具有邻近内周边的碟形部分的环形金属片条各自在其内周边处被紧固到两个金属体中的相应一个的上表面。 每个环形条的盘形部分包围绝缘环的一个正面或边缘表面，同时在其间留有空气间隙，并且每个环形带的外边缘部分延伸进入且刚性地嵌入塑料涂层中，该塑料涂层由 围绕绝缘环的外表面进行包装或喷涂。 绝缘环由不粘附到金属体或环形带并且具有高软化温度的材料制成。