公开(公告)号：US09704729B2

公开(公告)日：2017-07-11

申请号：US14301669

申请日：2014-06-11

Applicant: K.C. TECH CO., LTD.

Inventor： Moon Gi Cho ,  Jun Ho Son

IPC: H01L21/67 ,  A46B13/00 ,  B08B1/04

CPC classification number: H01L21/67046 ,  A46B13/001 ,  B08B1/04

Abstract: Provided are a substrate cleaning apparatus and method and a brush assembly used therein. The substrate cleaning apparatus for contact-cleaning a substrate includes a cleaning brush rotatably disposed in a cylindrical shape and having an outer circumferential surface contacting the substrate to clean the substrate. Here, the cleaning brush includes a plurality of pressure chambers expanding by a fluid pressure and disposed along a longitudinal direction of a rotation axis rotating at a central portion of the cleaning brush, and the plurality of pressure chambers are individually expandable to allow a portion of the outer circumferential surface to protrude in a radial direction and thus contact-clean a portion of the substrate.