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公开(公告)号:US11253944B2
公开(公告)日:2022-02-22
申请号:US16477714
申请日:2018-01-10
Inventor: Kenichi Watanabe , Reiichi Suzuki , Hideto Katsuma
IPC: B23K11/11 , B23K11/20 , B23K26/22 , B23K37/04 , B23K103/20
Abstract: A steel plate frame and a thin plate are made of different materials. A plurality of through holes are formed in a portion of the thin plate to be placed on the steel plate frame. A plurality of projections 6c are formed on a support plate, each of the projections being allowed to be inserted into a corresponding one of the through holes. An adhesive is applied to a portion of the steel plate frame on which the thin plate is placed. The thin plate is placed on the steel plate frame, and the steel plate frame and the thin plate are bonded together by the adhesive. The support plate is placed on the thin plate to insert the projections into the through holes. The projections and the steel plate frame are welded to form a plurality of welded spots.