公开(公告)号：US20140369884A1

公开(公告)日：2014-12-18

申请号：US14370153

申请日：2013-01-22

申请人： KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)

发明人： Yuki Tauchi ,  Yoko Shida ,  Hiroyuki Okuno

IPC分类号： C22C5/06 ,  G02B5/26 ,  H01B1/02 ,  C23C14/34 ,  C23C14/16

CPC分类号： C22C5/06 ,  B22F1/0018 ,  B82Y30/00 ,  C22C1/0466 ,  C22C5/08 ,  C23C14/165 ,  C23C14/3414 ,  G02B5/26 ,  H01B1/023

摘要： The present invention provides an Ag alloy film which exhibits a low-level electrical resistivity nearly equivalent to that of a pure Ag film and which is superior to a conventional Ag alloy film in durability (specifically, resistances to salt water and halogen) and in the adhesion to a substrate. Further, the deposition rate of this Ag alloy film by sputtering is as high as that of a pure Ag film. Provided is an Ag alloy film useful as a reflecting film and/or a transmitting film or as an electrical wiring and/or an electrode, including 0.1 to 1.5 atomic % of at least one element selected from Pd, Au and Pt, and 0.02 to 1.5 atomic % of at least one element selected from at least one rare earth element, Bi and Zn with the balance being Ag and inevitable impurities.

摘要翻译： 本发明提供一种Ag合金膜，其表现出与纯Ag膜相似的低水平电阻率，并且其耐久性（具体地，耐盐水和卤素电阻）优于常规Ag合金膜，并且在 对基材的粘附。 此外，通过溅射，该Ag合金膜的沉积速率与纯Ag膜的沉积速率一样高。 提供了可用作反射膜和/或透射膜或作为电布线和/或电极的Ag合金膜，其包含0.1至1.5原子％的选自Pd，Au和Pt中的至少一种元素，并且0.02至 1.5原子％的至少一种选自至少一种稀土元素的元素，Bi和Zn，余量为Ag和不可避免的杂质。

公开(公告)号：US20130140066A1

公开(公告)日：2013-06-06

申请号：US13661902

申请日：2012-10-26

申请人： Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

发明人： Hiroyuki Okuno ,  Aya Miki ,  Toshihiro Kugimiya

IPC分类号： H05K1/09 ,  C23C14/35 ,  C23C14/14

CPC分类号： C22C9/00 ,  B22F3/10 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06 ,  C22C2204/00 ,  C23C14/185 ,  C23C14/3414 ,  H01B1/026

摘要： Provided is a Cu alloy interconnection film for touch-panel sensors, which excels in oxidation resistance and adhesion properties, and is low in electrical resistance. The interconnection film contains at least one alloy element selected from a group consisting of Ni, Zn, and Mn by 0.1 to 40 atom % in total, and the remainder contains Cu and inevitable impurities. Alternatively, the interconnection film is made of a Cu alloy containing at least one element selected from the group consisting of Ni, Zn, and Mn. In this case, if the Cu alloy contains one element, Ni is contained by 0.1 to 6 atom %, or Zn is contained by 0.1 to 6 atom %, or Mn is contained by 0.1 to 1.9 atom %. On the other hand, if two or more alloy elements are contained, the alloy elements are contained by 0.1 to 6 atom % in total (wherein, Mn is contained by [((6−x)×2)/6] atom % or less if Mn is contained; here, x is a total adding amount of Ni and Zn).

摘要翻译： 提供一种用于触摸面板传感器的Cu合金互连膜，其耐氧化性和粘附性优异，并且电阻低。 互连膜含有选自Ni，Zn和Mn中的至少一种合金元素，总计为0.1至40原子％，余量包含Cu和不可避免的杂质。 或者，互连膜由含有选自Ni，Zn和Mn中的至少一种元素的Cu合金制成。 在这种情况下，如果Cu合金含有一种元素，则Ni的含量为0.1〜6原子％，或含有0.1〜6原子％的Zn，或含有0.1〜1.9原子％的Mn。 另一方面，如果含有两种以上的合金元素，则合金元素总计含有0.1〜6原子％（其中，Mn含有[（（6-x）×2）/ 6]原子％或 如果含有Mn，则少;这里，x是Ni和Zn的总添加量）。