公开(公告)号：US20170188477A1

公开(公告)日：2017-06-29

申请号：US15049232

申请日：2016-02-22

申请人： Kabushiki Kaisha Toshiba

发明人： Yoshiharu MATSUDA ,  Akitoshi SUZUKI

IPC分类号： H05K7/14 ,  H05K7/20

CPC分类号： H05K7/142 ,  H05K1/0203 ,  H05K1/144 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/2018 ,  H05K2201/2036

摘要： According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.

公开(公告)号：US20170188473A1

公开(公告)日：2017-06-29

申请号：US15049224

申请日：2016-02-22

申请人： Kabushiki Kaisha Toshiba

发明人： Akitoshi SUZUKI ,  Yoshiharu MATSUDA

IPC分类号： H05K5/00 ,  H05K7/20

CPC分类号： H05K5/0043 ,  H05K5/0047 ,  H05K7/2039

摘要： According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.

公开(公告)号：US20160270266A1

公开(公告)日：2016-09-15

申请号：US14842313

申请日：2015-09-01

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Yasuyuki OZAWA ,  Fuminori KIMURA ,  Masaaki NIIJIMA ,  Masahiro IIJIMA ,  Yoshiharu MATSUDA ,  Kenichi SAWANAKA ,  Kazuhiro YOSHIDA

IPC分类号： H05K7/20

CPC分类号： H05K7/20754

摘要： A semiconductor memory device includes a semiconductor memory unit, a memory controller, a cover unit having a first portion covering the semiconductor memory unit and a second portion covering the memory controller, a first heat conduction member disposed between the semiconductor memory unit and the first portion of the cover unit, and a second heat conduction member disposed between the memory controller and the second portion of the cover. The cover unit has a gap formed between the first and second portions.

摘要翻译： 一种半导体存储器件，包括半导体存储单元，存储器控制器，具有覆盖半导体存储单元的第一部分和覆盖存储器控制器的第二部分的盖单元，设置在半导体存储单元与第一部分之间的第一导热构件 和设置在存储器控制器和盖的第二部分之间的第二导热构件。 盖单元具有形成在第一和第二部分之间的间隙。