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公开(公告)号：US20200321858A1
公开(公告)日：2020-10-08
申请号：US16907309
申请日：2020-06-22
Applicant: KABUSHIKI KAISHA YASKAWA DENKI
Inventor： Ryosuke TSUMAGARI , Shigekatsu NAGATOMO , Yuto KUBO , Yuki TOKIMATSU
Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.
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公开(公告)号：US20170077832A1
公开(公告)日：2017-03-16
申请号：US15245181
申请日：2016-08-24
Applicant: KABUSHIKI KAISHA YASKAWA DENKI
Inventor： Ryosuke TSUMAGARI , Tetsuo YANAGIMOTO , Makoto NAKAYA , Yuki TOKIMATSU
CPC classification number: H02M7/003 , H05K7/1432
Abstract: An electrical machine includes a first substrate, a second substrate, and a conduction support. The first substrate has a mounting surface. The second substrate is disposed in an overlay direction from the first substrate. The conduction support electrically grounds the second substrate and supports the second substrate while keeping approximately no contact with the mounting surface of the first substrate.
Abstract translation: 电机包括第一基板，第二基板和导电支撑件。 第一基板具有安装表面。 第二基板从第一基板以覆盖方向设置。 导电支撑件电连接第二基板并且支撑第二基板，同时保持与第一基板的安装表面几乎不接触。
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