公开(公告)号：US20200321858A1

公开(公告)日：2020-10-08

申请号：US16907309

申请日：2020-06-22

Applicant: KABUSHIKI KAISHA YASKAWA DENKI

Inventor： Ryosuke TSUMAGARI ,  Shigekatsu NAGATOMO ,  Yuto KUBO ,  Yuki TOKIMATSU

IPC: H02M1/44 ,  H01R12/75 ,  H05K1/14 ,  H02M7/44 ,  H02M7/00

Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.

公开(公告)号：US20170150654A1

公开(公告)日：2017-05-25

申请号：US15343394

申请日：2016-11-04

Applicant: Kabushiki Kaisha Yaskawa Denki

Inventor： Yuto KUBO ,  Makoto NAKAYA ,  Tetsuo YANAGIMOTO ,  Ryosuke TSUMAGARI

IPC: H05K7/20 ,  H05K7/14 ,  H05K5/03 ,  H02M7/00

CPC classification number: H05K7/20909 ,  H02M7/003 ,  H05K5/03 ,  H05K7/1427 ,  H05K7/20918

Abstract: A power converter includes a housing, a circuit element, and a cover. The housing includes a first space and a second space. In the first space, a circuit substrate is disposed. In the second space, a passage for a cooling fluid is disposed. The circuit element is disposed on the circuit substrate in the first space and protrudes into the second space. The cover covers at least a portion of the circuit element and includes a first portion and a second portion. The first portion protrudes from near the circuit substrate into the second space, and defines a first region that has a first area. The second portion protrudes from the first portion, and defines a second region that has a second area. The first area is larger than the second area as viewed from a direction in which the circuit element protrudes.

公开(公告)号：US20170077832A1

公开(公告)日：2017-03-16

申请号：US15245181

申请日：2016-08-24

Applicant: KABUSHIKI KAISHA YASKAWA DENKI

Inventor： Ryosuke TSUMAGARI ,  Tetsuo YANAGIMOTO ,  Makoto NAKAYA ,  Yuki TOKIMATSU

IPC: H02M7/00 ,  H05K1/02 ,  H05K5/00 ,  H05K7/14

CPC classification number: H02M7/003 ,  H05K7/1432

Abstract: An electrical machine includes a first substrate, a second substrate, and a conduction support. The first substrate has a mounting surface. The second substrate is disposed in an overlay direction from the first substrate. The conduction support electrically grounds the second substrate and supports the second substrate while keeping approximately no contact with the mounting surface of the first substrate.

Abstract translation: 电机包括第一基板，第二基板和导电支撑件。 第一基板具有安装表面。 第二基板从第一基板以覆盖方向设置。 导电支撑件电连接第二基板并且支撑第二基板，同时保持与第一基板的安装表面几乎不接触。