公开(公告)号：US20230250317A1

公开(公告)日：2023-08-10

申请号：US18133393

申请日：2023-04-11

Applicant: KANEKA CORPORATION

Inventor： Fumiya Kono ,  Takayoshi Akiyama ,  Mami Akisada ,  Mari Uno

IPC: C09J7/38 ,  C09J7/25 ,  H05K1/03

CPC classification number: C09J7/38 ,  C09J7/25 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154

Abstract: A multi-layered polyimide film includes a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide. A dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a temperature of 23° C. and a relative humidity of 50% is 0.0030 or less. The adhesive layer has no melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100° C. or higher and 420° C. or lower. The polyimide contained in the adhesive layer has one or more tetracarboxylic dianhydride residues selected from a pyromellitic dianhydride residue and a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, and one or more diamine residues selected from a 1,3-bis(4-aminophenoxy)benzene residue and a 4,4′-diamino-2,2′-dimethylbiphenyl residue.