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公开(公告)号：US11597055B2
公开(公告)日：2023-03-07
申请号：US16400554
申请日：2019-05-01
Applicant: KCTECH CO., LTD.
Inventor： Jun Ho Son , Sung Ho Shin
IPC: B24B37/04 , B24B37/30 , B24B37/32 , B24B37/005
Abstract: Provided are a membrane and carrier head using the membrane for polishing apparatus. The membrane comprises a first fixing flap extending inwards from the upper part of a side portion, a second fixing flap extending upwards from the upper part of the side portion, wherein the second fixing flap has a first inclined part, a second inclined part and a third extending part of extending upwards whereby a compensation force generated by the inclined parts realize the constant pressing force to the edge of a substrate during a polishing process.
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