公开(公告)号：US20240029964A1

公开(公告)日：2024-01-25

申请号：US18216110

申请日：2023-06-29

Applicant: KEMET Electronics Corporation

Inventor： Vania Pais ,  Joao Parada ,  Débora Sá ,  Felipe Schmidt ,  Rui A. Monteiro ,  Victor Andoralov

IPC: H01G11/84 ,  C08G61/12 ,  C09D5/24 ,  C09D165/00 ,  C09D7/45 ,  C09D7/63 ,  C09D7/20 ,  H01G11/60 ,  H01G11/62 ,  H01G11/80

CPC classification number: H01G11/84 ,  C08G61/126 ,  C09D5/24 ,  C09D165/00 ,  C09D7/45 ,  C09D7/63 ,  C09D7/20 ,  H01G11/60 ,  H01G11/62 ,  H01G11/80 ,  C08G2261/122 ,  C08G2261/334 ,  C08G2261/148 ,  C08G2261/1452 ,  C08G2261/514

Abstract: An improved dispersion, which is particularly suitable for use in forming a hybrid capacitor, and improved method for forming a hybrid capacitor, and an improved capacitor is provided. The method comprises forming a dispersion comprising a conductive polymer, a dispersing agent, a monomer of the conductive polymer and a molar excess of anionic counterion per mole of conductive polymer and monomer. The dispersion is homogenized to form a homogenized dispersion. A capacitor is formed comprising a conductive layer formed from the homogenized dispersion.