公开(公告)号：US20220336597A1

公开(公告)日：2022-10-20

申请号：US17640886

申请日：2020-09-09

Applicant: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

Inventor： Thomas D. ANTHOPOULOS ,  Kalaivanan LOGANATHAN ,  Emre YARALI ,  Emre YENGEL ,  Hendrik Andreas FABER

IPC: H01L29/41 ,  H01L29/06 ,  H01L29/786 ,  H01L21/283

Abstract: A method for manufacturing a solid state device with a self-forming nanogap includes patterning a first metallic layer (M1) to form a first electrode on a substrate; depositing a self-assembling monolayer, SAM, layer over and around the first electrode; forming a second metallic layer (M2) in contact with the SAM layer and the substrate; and touchlessly removing parts of the second metallic layer (M2) that is formed directly above the SAM layer, to form a second electrode, and a nanogap between the first electrode and the second electrode.

公开(公告)号：US20220332570A1

公开(公告)日：2022-10-20

申请号：US17640890

申请日：2020-09-09

Applicant: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

Inventor： Thomas D. ANTHOPOULOS ,  Kalaivanan LOGANATHAN ,  Ulrich BUTTNER ,  Emre YENGEL ,  Hendrik Andreas FABER

IPC: B81C99/00 ,  B29C33/38 ,  B29C33/42 ,  G03F7/00 ,  B01L3/00

Abstract: A method for manufacturing a soft stamp includes providing a substrate having a first electrode and a second electrode, the second electrode being formed at a distance less than 100 nm from the first electrode so that a nanogap Ng is formed between the first and second electrodes; pouring a curable substance over the first and second electrodes and into the nanogap Ng; curing the curable substance to form a soft stamp; and removing the soft stamp from the first and second electrodes. The soft stamp has a nano-feature having a size less than 100 nm.