SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20100109133A1

    公开(公告)日:2010-05-06

    申请号:US12608307

    申请日:2009-10-29

    IPC分类号: H01L23/552

    摘要: A highly flexible semiconductor device of a stacked-type semiconductor device which transfers information by inductive coupling between inductors, in which LSI chips can be stacked even when a transmitter circuit and a receiver circuit are arranged at different positions from each other when viewed in a stacking direction. The semiconductor device has an interposer including a first inductor which is inductively coupled with a transmitter circuit of a first LSI chip to be stacked, and a second inductor which is inductively coupled with a receiver circuit of a second LSI chip to be stacked, the first inductor and the second inductor being electrically connected. An interchip communication is made from the first LSI chip to the second LSI chip.

    摘要翻译: 层叠型半导体装置的高度柔性的半导体装置,其通过电感器之间的电感耦合传送信息,即使当发送器电路和接收器电路在堆叠中观察时彼此不同的位置被布置时,也可以堆叠LSI芯片 方向。 半导体器件具有内插器,其包括与要堆叠的第一LSI芯片的发射器电路电感耦合的第一电感器和与要堆叠的第二LSI芯片的接收器电路感应耦合的第二电感器,第一电感器 电感器和第二电感器电连接。 从第一LSI芯片到第二LSI芯片进行芯片间通信。