公开(公告)号：US11688052B2

公开(公告)日：2023-06-27

申请号：US16989849

申请日：2020-08-10

Applicant: KLA Corporation

Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

IPC: G06T7/00 ,  H01L21/66

CPC classification number: G06T7/0004 ,  H01L22/12 ,  H01L22/20 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the weak patterns identified; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

公开(公告)号：US20200372630A1

公开(公告)日：2020-11-26

申请号：US16989849

申请日：2020-08-10

Applicant: KLA Corporation

Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

IPC: G06T7/00 ,  H01L21/66

Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the weak patterns identified; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.