公开(公告)号：US11688052B2

公开(公告)日：2023-06-27

申请号：US16989849

申请日：2020-08-10

Applicant: KLA Corporation

Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

IPC: G06T7/00 ,  H01L21/66

CPC classification number: G06T7/0004 ,  H01L22/12 ,  H01L22/20 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the weak patterns identified; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

公开(公告)号：US20200372630A1

公开(公告)日：2020-11-26

申请号：US16989849

申请日：2020-08-10

Applicant: KLA Corporation

Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

IPC: G06T7/00 ,  H01L21/66

Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the weak patterns identified; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

公开(公告)号：US20220230293A1

公开(公告)日：2022-07-21

申请号：US17713017

申请日：2022-04-04

Applicant: KLA Corporation

Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

IPC: G06T7/00

Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.