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公开(公告)号：US20240221141A1
公开(公告)日：2024-07-04
申请号：US18090447
申请日：2022-12-28
Applicant: KLA Corporation
Inventor： Hsiao-Min Wang , Hucheng Lee
CPC classification number: G06T7/0004 , G06T7/12 , G06T7/136 , G06T2207/30148
Abstract: During semiconductor wafer inspection, an image of a semiconductor wafer is divided into segments. A standard deviation for each of the segments is determined using a difference image. A threshold is then applied to each of the segments. The threshold can be a multiple of the standard deviation. Pixels in the image that include a defect are determined after applying the threshold. The pixels outside the threshold are then labeled as defects-of-interest using the processor.
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