-
公开(公告)号：US10724964B1
公开(公告)日：2020-07-28
申请号：US16379900
申请日：2019-04-10
Applicant: KLA-TENCOR CORPORATION
Inventor： Pablo Pombo , Kurt Lehman
Abstract: Sensor units can be disposed in a support member. Each of the sensor units can include a folded flex board having a plurality of laminations and an aperture and a sensor disposed in the folded flex board such that the sensor is positioned over the aperture. The system can be used in broad band plasma inspection tools for semiconductor wafers.
Search Results
1
records
(took 0.013 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
