公开(公告)号：US20190391557A1

公开(公告)日：2019-12-26

申请号：US16013344

申请日：2018-06-20

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Yaniv Abramovitz

IPC: G05B19/401

Abstract: Methods and metrology modules are provided, which derive landscape information (expressing relation(s) between metrology metric(s) and measurement parameters) from produced wafers, identifying therein indications for production process changes, and modify production process parameters with respect to the identified indications, to maintain the production process within specified requirements. Process changes may be detected in wafer(s), wafer lot(s) and batches, and the information may be used to detect root causes for the changes with respect to production tools and steps and to indicate tool aging and required maintenance. The information and its analysis may further be used to optimize the working point parameters, to optimizing designs of devices and/or targets and/or to train corresponding algorithms to perform the identifying, e.g., using training wafers.

公开(公告)号：US10962951B2

公开(公告)日：2021-03-30

申请号：US16013344

申请日：2018-06-20

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Yaniv Abramovitz

IPC: G05B19/401

Abstract: Methods and metrology modules are provided, which derive landscape information (expressing relation(s) between metrology metric(s) and measurement parameters) from produced wafers, identifying therein indications for production process changes, and modify production process parameters with respect to the identified indications, to maintain the production process within specified requirements. Process changes may be detected in wafer(s), wafer lot(s) and batches, and the information may be used to detect root causes for the changes with respect to production tools and steps and to indicate tool aging and required maintenance. The information and its analysis may further be used to optimize the working point parameters, to optimizing designs of devices and/or targets and/or to train corresponding algorithms to perform the identifying, e.g., using training wafers.