SIMULTANEOUS MULTI-DIRECTIONAL LASER WAFER INSPECTION

    公开(公告)号:US20200333262A1

    公开(公告)日:2020-10-22

    申请号:US16946742

    申请日:2020-07-02

    Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample

    Simultaneous multi-directional laser wafer inspection

    公开(公告)号:US11366069B2

    公开(公告)日:2022-06-21

    申请号:US16946742

    申请日:2020-07-02

    Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.

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