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公开(公告)号：US11287248B2
公开(公告)日：2022-03-29
申请号：US16806076
申请日：2020-03-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Maarten van der Burgt , Sheng Liu , Andy Hill , Johan De Greeve , Karel van Gils
Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.
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公开(公告)号：US20200217651A1
公开(公告)日：2020-07-09
申请号：US16806076
申请日：2020-03-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Maarten van der Burgt , Sheng Liu , Andy Hill , Johan De Greeve , Karel van Gils
Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.
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公开(公告)号：US10670537B2
公开(公告)日：2020-06-02
申请号：US16357025
申请日：2019-03-18
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , J. K. Leong , Michael Kirk
Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.
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公开(公告)号：US09945792B2
公开(公告)日：2018-04-17
申请号：US13719928
申请日：2012-12-19
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao
CPC classification number: G01N21/9501 , G01N21/8806 , G01N21/956 , G02B27/0905 , G02B27/0944 , G02B27/425
Abstract: A system which may be used to generate a plurality of spots on a surface is provided. The spots may be aligned with the incident plane of oblique illumination. The system may include a diffractive optical element configured to split a beam into a plurality of beams by generating a plurality of diffraction orders. The system may also include a focusing lens configured to focus at least some of the plurality of beams on the surface in the plurality of spots. At least some of the plurality of beams may be focused on the surface at an oblique illumination angle. The system may also include an illumination source positioned off-axis relative to an optical axis of the diffractive optical element. Using the system, a plurality of spots may be generated on an inclined surface.
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公开(公告)号：US09915622B2
公开(公告)日：2018-03-13
申请号：US14838194
申请日：2015-08-27
Applicant: KLA-Tencor Corporation
Inventor： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak , Mehdi Vaez-Iravani , Guoheng Zhao
IPC: G01N21/95 , G01N21/47 , G01N21/88 , G01N21/956
CPC classification number: G01N21/9501 , G01N21/47 , G01N21/8806 , G01N21/8851 , G01N21/956
Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.
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Patent Agency Ranking
公开(公告)号：US09874526B2
公开(公告)日：2018-01-23
申请号：US15468608
申请日：2017-03-24
Applicant: KLA-Tencor Corporation
Inventor： Sheng Liu , Guoheng Zhao
CPC classification number: G01N21/8806 , G01N21/21 , G01N21/9501 , G01N2021/8848 , G01N2201/0683
Abstract: Disclosed are methods and apparatus for inspecting a semiconductor sample. This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system further includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, followed by a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, followed by a rotatable analyzer. The system also includes a controller that is configured for (i) selecting a polarization of the incident beam, (ii) obtaining a defect scattering map, (iii) obtaining a surface scattering map, and (iv) determining a configuration of the one or more polarization components, aperture mask, and rotatable ¼ waveplate, and analyzer based on analysis of the defect and surface scattering map so as to maximize a defect signal to noise ratio,
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公开(公告)号：US09291575B2
公开(公告)日：2016-03-22
申请号：US14530805
申请日：2014-11-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Jenn-Kuen Leong , Mehdi Vaez-Iravani
CPC classification number: G01N21/9501 , G01N21/21 , G01N21/47 , G01N21/8806 , G01N2201/06113 , H01L22/12 , H01L2924/0002 , H01L2924/00
Abstract: Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.
Abstract translation: 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统，被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件，被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离，其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件，被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器，被配置为检测散射光的不同部分中的一个，并且响应于检测到的光而产生输出，所述检测光用于检测晶片上的缺陷。
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公开(公告)号：US20150377795A1
公开(公告)日：2015-12-31
申请号：US14851887
申请日：2015-09-11
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , David W. Shortt
Abstract: A system and method for inspecting a surface of a wafer. The system includes a source generating an optical beam at a deep ultraviolet wavelength; a solid immersion lens, receiving the optical beam, positioned such that the air gap between the lens and the wafer surface is less than the wavelength, an enhanced electric field being generated at the wafer surface, at least one particle on the wafer receiving the enhanced electric field generating scattered light; a detector receiving the scattered light and generating a corresponding electrical signal; and a processor receiving and analyzing the electrical signal.
Abstract translation: 一种用于检查晶片表面的系统和方法。 该系统包括产生深紫外波长的光束的源; 固体浸没透镜，接收光束，定位成使得透镜和晶片表面之间的气隙小于波长，在晶片表面产生增强的电场，晶片上的至少一个颗粒接收增强的 电场产生散射光; 接收散射光并产生相应的电信号的检测器; 以及接收和分析电信号的处理器。
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9.发明申请公开(公告)号：US20150370175A1
公开(公告)日：2015-12-24
申请号：US14741866
申请日：2015-06-17
Applicant: KLA-Tencor Corporation
Inventor： Lena Nicolaides , Ben-ming Benjamin Tsai , Prashant A. Aji , Michael Gasvoda , Stanley E. Stokowski , Guoheng Zhao , Youxian Wen , Mohan Mahadevan , Paul D. Horn , Wolfgang Vollrath , Isabella T. Lewis
CPC classification number: G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
Abstract translation: 公开了用于检查和处理半导体晶片的方法和装置。 该系统包括边缘检测系统，用于接收将进行光刻工艺的每个晶片。 边缘检测系统包括用于将一个或多个照明光束朝向位于晶片的边界区域内的侧面，顶部和底部边缘部分引导的照明通道。 边缘检测系统还包括用于收集和感测从晶片的边缘部分散射或反射的输出辐射的收集模块和用于定位边缘部分中的缺陷的分析器模块，并且基于所感测到的每个晶片是否在规格范围内 这种晶片的输出辐射。 光刻系统被配置为从边缘检测系统接收已发现在规格范围内的每个晶片。 边缘检测系统与光刻系统成对连接。
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公开(公告)号：US20140268118A1
公开(公告)日：2014-09-18
申请号：US13834662
申请日：2013-03-15
Applicant: KLA-TENCOR CORPORATION
Inventor： Zhiwei Xu , Christian Wolters , Juergen Reich , Bret Whiteside , Guoheng Zhao , Jijen Vazhaeparambil , Stephen Biellak , Sam Shamouilian , Mehdi Vaez-Iravani
IPC: G01N21/95
CPC classification number: G01N21/9501 , G01N21/956
Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.
Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。
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