Illumination Energy Management in Surface Inspection
    1.
    发明申请
    Illumination Energy Management in Surface Inspection 有权
    表面检查照明能源管理

    公开(公告)号:US20140118729A1

    公开(公告)日:2014-05-01

    申请号:US13662626

    申请日:2012-10-29

    CPC classification number: G01N21/8806 F21V23/003 G01N21/9501 G01N2021/8835

    Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

    Abstract translation: 本公开涉及一种管理照射能量的系统和方法,所述照明能量施加到被扫描的晶片的照明部分,以减轻照射诱发的损伤,而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片,以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。

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