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公开(公告)号：US20180038803A1
公开(公告)日：2018-02-08
申请号：US15230330
申请日：2016-08-05
Applicant: KLA-Tencor Corporation
Inventor： Steve (Yifeng) Cui , Chunsheng Huang , Chunhai Wang , Christian Wolters , Bret Whiteside , Anatoly G. Romanovsky , Chuanyong Huang , Donald Warren Pettibone
CPC classification number: G01N21/9501 , G01N21/956
Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.
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公开(公告)号：US08786850B2
公开(公告)日：2014-07-22
申请号：US13662626
申请日：2012-10-29
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。
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公开(公告)号：US10088345B1
公开(公告)日：2018-10-02
申请号：US13693769
申请日：2012-12-04
Applicant: KLA-Tencor Corporation
Inventor： Chuanyong Huang , Raymond Chu , Gordana Neskovic , Dieter Wilk , Christian Wolters , Tim Mahatdejkul
Abstract: The present disclosure is directed to a method for designing an aperture in a mask for inspecting a wafer. The method includes the steps of scanning a collection plane of the wafer at a plurality of points and collecting data for at least a part of the wafer. The method also includes the step of mapping the data. A further step of the method includes configuring the aperture based on the mapped data.
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4.发明申请System and Method for Reducing Radiation-Induced False Counts in an Inspection System 有权在检测系统中减少辐射诱发的错误计数的系统和方法公开(公告)号：US20160334516A1
公开(公告)日：2016-11-17
申请号：US14946563
申请日：2015-11-19
Applicant: KLA-Tencor Corporation
Inventor： Ximan Jiang , Anatoly Romanovsky , Christian Wolters , Stephen Biellak
CPC classification number: G01T1/24 , G01N21/9501
Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.
Abstract translation: 具有辐射诱导的假计数减轻的检查系统包括被配置为照亮样本的照明源，检测器组件，包括被配置为检测来自样品的照明的照明传感器，以及被配置为检测粒子辐射的一个或多个辐射传感器，以及控制电路 通信地耦合到检测器。 控制电路被配置为执行以下步骤：基于从辐射传感器接收的一个或多个辐射信号来确定一组辐射检测事件，基于从照明传感器接收的照明信号确定一组成像事件，将该组 的辐射检测事件发生到所述一组成像事件以产生一组重合事件，其中所述一致事件包括同时成像和辐射检测事件，并且从所述一组成像事件中排除所述一致事件组合以产生一组 发现缺陷点。
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公开(公告)号：US20140268118A1
公开(公告)日：2014-09-18
申请号：US13834662
申请日：2013-03-15
Applicant: KLA-TENCOR CORPORATION
Inventor： Zhiwei Xu , Christian Wolters , Juergen Reich , Bret Whiteside , Guoheng Zhao , Jijen Vazhaeparambil , Stephen Biellak , Sam Shamouilian , Mehdi Vaez-Iravani
IPC: G01N21/95
CPC classification number: G01N21/9501 , G01N21/956
Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.
Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。
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Patent Agency Ranking
公开(公告)号：US10241217B2
公开(公告)日：2019-03-26
申请号：US15795028
申请日：2017-10-26
Applicant: KLA-Tencor Corporation
Inventor： Ximan Jiang , Anatoly Romanovsky , Christian Wolters , Stephen Biellak , Mous Tatarkhanov
Abstract: An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.
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公开(公告)号：US20180045837A1
公开(公告)日：2018-02-15
申请号：US15795028
申请日：2017-10-26
Applicant: KLA-Tencor Corporation
Inventor： Ximan Jiang , Anatoly Romanovsky , Christian Wolters , Stephen Biellak , Mous Tatarkhanov
CPC classification number: G01T1/24 , G01N21/9501
Abstract: An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.
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公开(公告)号：US09255891B2
公开(公告)日：2016-02-09
申请号：US14036360
申请日：2013-09-25
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Zhiwei Xu , Juergen Reich
CPC classification number: G01N21/9501
Abstract: Methods and systems for reshaping the beam intensity distribution of an illumination light supplied to a specimen under inspection are presented. A scanning surface inspection system includes a beam shaping element that flattens the beam intensity distribution of a beam of light generated by an illumination source. The reshaped illumination light is directed to the wafer surface over an illumination spot. With a flattened beam intensity distribution, the incident beam power can be increased without the beam intensity exceeding the damage threshold of the wafer at any particular location. In addition, the illumination spot is shaped by the beam shaping element to have a variable beam width in a direction parallel to the inspection track. The location of a defect within an inspection area having a variable beam width is estimated based on an analysis of the output of the detector.
Abstract translation: 提出了改造供应给检验样本的照明光束的光束强度分布的方法和系统。 扫描面检查系统包括使由照明源产生的光束的光束强度分布变平的光束成形元件。 重新整形的照明光在照明点上被引导到晶片表面。 通过平坦的光束强度分布，可以增加入射光束功率，而不会使光束强度超过任何特定位置的晶片的损伤阈值。 此外，照明光斑通过光束成形元件成形，以在与检查轨道平行的方向上具有可变的光束宽度。 基于对检测器的输出的分析来估计具有可变波束宽度的检查区域内的缺陷的位置。
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公开(公告)号：US20140328043A1
公开(公告)日：2014-11-06
申请号：US14336810
申请日：2014-07-21
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
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公开(公告)号：US20140139829A1
公开(公告)日：2014-05-22
申请号：US14036360
申请日：2013-09-25
Applicant: KLA-TENCOR CORPORATION
Inventor： Christian Wolters , Zhiwei Xu , Juergen Reich
IPC: G01N21/95
CPC classification number: G01N21/9501
Abstract: Methods and systems for reshaping the beam intensity distribution of an illumination light supplied to a specimen under inspection are presented. A scanning surface inspection system includes a beam shaping element that flattens the beam intensity distribution of a beam of light generated by an illumination source. The reshaped illumination light is directed to the wafer surface over an illumination spot. With a flattened beam intensity distribution, the incident beam power can be increased without the beam intensity exceeding the damage threshold of the wafer at any particular location. In addition, the illumination spot is shaped by the beam shaping element to have a variable beam width in a direction parallel to the inspection track. The location of a defect within an inspection area having a variable beam width is estimated based on an analysis of the output of the detector.
Abstract translation: 提出了改造供应给检验样本的照明光束的光束强度分布的方法和系统。 扫描表面检查系统包括光束成形元件，其平坦化由照明源产生的光束的光束强度分布。 重新整形的照明光在照明点上被引导到晶片表面。 通过平坦的光束强度分布，可以增加入射光束功率，而不会使光束强度超过任何特定位置的晶片的损伤阈值。 此外，照明光斑通过光束成形元件成形，以在与检查轨道平行的方向上具有可变的光束宽度。 基于对检测器的输出的分析来估计具有可变波束宽度的检查区域内的缺陷的位置。
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