公开(公告)号：US20190385882A1

公开(公告)日：2019-12-19

申请号：US16152731

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Haoran Jiang

IPC: H01L21/683 ,  H01L21/68

Abstract: An assembly for clamping semiconductor wafers includes a plate and an electrostatic chuck mounted on the plate. A plurality of slots extends between respective portions of the electrostatic chuck to receive arms of an end-effector of a wafer-handler. The arms of the end-effector support semiconductor wafers being placed onto and removed from the electrostatic chuck.

公开(公告)号：US11121019B2

公开(公告)日：2021-09-14

申请号：US16152731

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Haoran Jiang

IPC: H01L21/68 ,  H01L21/683

Abstract: An assembly for clamping semiconductor wafers includes a plate and an electrostatic chuck mounted on the plate. A plurality of slots extends between respective portions of the electrostatic chuck to receive arms of an end-effector of a wafer-handler. The arms of the end-effector support semiconductor wafers being placed onto and removed from the electrostatic chuck.