公开(公告)号：US20150063677A1

公开(公告)日：2015-03-05

申请号：US14468237

申请日：2014-08-25

Applicant: KLA-Tencor Corporation

Inventor： Junqing Huang ,  Huan Jin ,  Grace Hsiu-Ling Chen ,  Lisheng Gao

IPC: G01N21/95 ,  G06T5/00

CPC classification number: G01N21/9501 ,  G06T5/002 ,  G06T2207/20061 ,  G06T2207/30148

Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.

Abstract translation: 提供了从晶片检查结果过滤划痕的方法和系统。 一种方法包括生成缺陷候选图，其包括作为晶片上的位置的函数的潜在缺陷候选的图像数据，并且从缺陷候选图中去除噪声以生成滤波的缺陷候选图。 该方法还包括基于与潜在缺陷候选对应的经滤波的缺陷候选映射的部分来确定潜在缺陷候选的一个或多个特性。 此外，该方法包括基于为每个潜在缺陷候选确定的一个或多个特性确定每个潜在的缺陷候选是否划伤，并且将确定为划痕的潜在缺陷候选与检查结果中的其他缺陷分离为 晶圆。

公开(公告)号：US09442077B2

公开(公告)日：2016-09-13

申请号：US14468237

申请日：2014-08-25

Applicant: KLA-Tencor Corporation

Inventor： Junqing Huang ,  Huan Jin ,  Grace Hsiu-Ling Chen ,  Lisheng Gao

IPC: G06K9/62 ,  G01N21/95 ,  G06T5/00

CPC classification number: G01N21/9501 ,  G06T5/002 ,  G06T2207/20061 ,  G06T2207/30148

Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.

Abstract translation: 提供了从晶片检查结果过滤划痕的方法和系统。 一种方法包括生成缺陷候选图，其包括作为晶片上的位置的函数的潜在缺陷候选的图像数据，并且从缺陷候选图中去除噪声以生成滤波的缺陷候选图。 该方法还包括基于与潜在缺陷候选对应的经滤波的缺陷候选映射的部分来确定潜在缺陷候选的一个或多个特性。 此外，该方法包括基于为每个潜在缺陷候选确定的一个或多个特性确定每个潜在的缺陷候选是否划伤，并且将确定为划痕的潜在缺陷候选与检查结果中的其他缺陷分离为 晶圆。