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    Nuisance Reduction Using Location-Based Attributes
    2.
    发明申请
    Nuisance Reduction Using Location-Based Attributes 审中-公开

    公开(公告)号：US20190050974A1

    公开(公告)日：2019-02-14

    申请号：US15858511

    申请日：2017-12-29

    Applicant: KLA-Tencor Corporation

    Inventor： Bjorn Brauer ,  Junqing Huang ,  Lisheng Gao

    IPC: G06T7/00 ,  G06T7/73

    Abstract: Methods and systems are disclosed that provide nuisance reduction in images, such as semiconductor images that include one or more metal lines. A potential defect is correlated against pixel grey level intensity charts for two perpendicular axes. A position of the potential defect relative to a pattern, such as a metal line, is determined along the two axes. The potential defect can be classified as a defect of interest or nuisance event.

    Adaptive local threshold and color filtering
    3.
    发明授权
    Adaptive local threshold and color filtering 有权

    公开(公告)号：US09704234B2

    公开(公告)日：2017-07-11

    申请号：US14450170

    申请日：2014-08-01

    Applicant: KLA-Tencor Corporation

    Inventor： Junqing Huang ,  Hucheng Lee ,  Kenong Wu ,  Lisheng Gao

    IPC: G06T7/00 ,  G06T7/90

    CPC classification number: G06T7/0008 ,  G06T7/0006 ,  G06T7/90 ,  G06T2207/10024 ,  G06T2207/20024 ,  G06T2207/20076 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.

    Scratch filter for wafer inspection
    4.
    发明授权
    Scratch filter for wafer inspection 有权
    刮片过滤器用于晶片检查

    公开(公告)号：US09442077B2

    公开(公告)日：2016-09-13

    申请号：US14468237

    申请日：2014-08-25

    Applicant: KLA-Tencor Corporation

    Inventor： Junqing Huang ,  Huan Jin ,  Grace Hsiu-Ling Chen ,  Lisheng Gao

    IPC: G06K9/62 ,  G01N21/95 ,  G06T5/00

    CPC classification number: G01N21/9501 ,  G06T5/002 ,  G06T2207/20061 ,  G06T2207/30148

    Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.

    Abstract translation: 提供了从晶片检查结果过滤划痕的方法和系统。 一种方法包括生成缺陷候选图，其包括作为晶片上的位置的函数的潜在缺陷候选的图像数据，并且从缺陷候选图中去除噪声以生成滤波的缺陷候选图。 该方法还包括基于与潜在缺陷候选对应的经滤波的缺陷候选映射的部分来确定潜在缺陷候选的一个或多个特性。 此外，该方法包括基于为每个潜在缺陷候选确定的一个或多个特性确定每个潜在的缺陷候选是否划伤，并且将确定为划痕的潜在缺陷候选与检查结果中的其他缺陷分离为 晶圆。

    Nuisance reduction using location-based attributes
    5.
    发明授权
    Nuisance reduction using location-based attributes 有权

    公开(公告)号：US10600177B2

    公开(公告)日：2020-03-24

    申请号：US15858511

    申请日：2017-12-29

    Applicant: KLA-Tencor Corporation

    Inventor： Bjorn Brauer ,  Junqing Huang ,  Lisheng Gao

    IPC: G06T7/00 ,  G06T7/73

    Abstract: Methods and systems are disclosed that provide nuisance reduction in images, such as semiconductor images that include one or more metal lines. A potential defect is correlated against pixel grey level intensity charts for two perpendicular axes. A position of the potential defect relative to a pattern, such as a metal line, is determined along the two axes. The potential defect can be classified as a defect of interest or nuisance event.

    Detecting defects on a wafer
    7.
    发明授权
    Detecting defects on a wafer 有权
    检测晶圆上的缺陷

    公开(公告)号：US09053527B2

    公开(公告)日：2015-06-09

    申请号：US13733133

    申请日：2013-01-02

    Applicant: KLA-Tencor Corporation

    Inventor： Jun Lang ,  Kan Chen ,  Lisheng Gao ,  Junqing Huang

    IPC: G06K9/00 ,  G06T7/00 ,  G03F7/20 ,  G01N21/88 ,  G01N21/95

    CPC classification number: G06T7/0004 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8867 ,  G03F7/70616 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/10152 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.

    Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括识别对应于晶片上形成的图案化特征的一个或多个几何特征的晶片产生的第一原始输出的一个或多个特征，并且基于所识别的将针对晶片生成的第二原始输出中的各个输出分配给不同的段 第一原始输出的一个或多个特征，并且基于第二原始输出中的单独输出和在第一原始输出中在晶片上的基本相同位置处产生的单独输出，使得图案化的一个或多个几何特征 对应于第二原始输出中的每个不同段的特征是不同的。

    Visual Feedback for Inspection Algorithms and Filters
    8.
    发明申请
    Visual Feedback for Inspection Algorithms and Filters 审中-公开
    检查算法和滤波器的视觉反馈

    公开(公告)号：US20160210526A1

    公开(公告)日：2016-07-21

    申请号：US13685808

    申请日：2012-11-27

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Hucheng Lee ,  Junqing Huang ,  Lisheng Gao

    IPC: G06K9/40

    Abstract: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.

    Abstract translation: 本公开旨在为检查算法和差分滤波器提供用于处理来自检查系统的测试和参考图像的视觉反馈。 可以将用户界面配置为显示信息并接受用户命令。 通信地耦合到用户界面的计算系统可以被配置为接收由检查系统收集的至少一组测试和参考图像。 计算系统还可以被配置为经由用户界面提供测试和参考图像的至少一个视觉表示，以显示检查算法和/或差分滤波器的效果。

    Tuning wafer inspection recipes using precise defect locations
    9.
    发明授权
    Tuning wafer inspection recipes using precise defect locations 有权
    使用精确的缺陷位置调整晶圆检查配方

    公开(公告)号：US09224660B2

    公开(公告)日：2015-12-29

    申请号：US14470916

    申请日：2014-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Ashok V. Kulkarni ,  Lisheng Gao ,  Junqing Huang

    IPC: G01N21/00 ,  H01L21/66 ,  G01N21/95

    CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L22/20

    Abstract: Systems and methods for determining one or more parameters of a wafer inspection process are provided. One method includes aligning optical image(s) of an alignment target to their corresponding electron beam images generated by an electron beam defect review system. The method also includes determining different local coordinate transformations for different subsets of alignment targets based on results of the aligning. In addition, the method includes determining positions of defects in wafer inspection system coordinates based on coordinates of the defects determined by the electron beam defect review system and the different local coordinate transformations corresponding to different groups of the defects into which the defects have been separated. The method further includes determining one or more parameters for an inspection process for the wafer based on defect images acquired at the determined positions by a wafer inspection system.

    Abstract translation: 提供了用于确定晶片检查过程的一个或多个参数的系统和方法。 一种方法包括将对准靶的光学图像与由电子束缺陷检查系统产生的相应的电子束图像对准。 该方法还包括基于对准的结果确定不同的对准目标子集的不同局部坐标变换。 此外，该方法包括基于由电子束缺陷评估系统确定的缺陷的坐标以及对应于缺陷已分离的缺陷的不同组的不同局部坐标变换来确定晶片检查系统坐标中缺陷的位置。 该方法还包括基于由晶片检查系统在所确定的位置处获取的缺陷图像来确定用于晶片的检查处理的一个或多个参数。

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