公开(公告)号：US11010885B2

公开(公告)日：2021-05-18

申请号：US16406374

申请日：2019-05-08

Applicant: KLA-Tencor Corporation

Inventor： Bjorn Brauer ,  Richard Wallingford ,  Kedar Grama ,  Hucheng Lee ,  Sangbong Park

IPC: G06K9/00 ,  G06T7/00 ,  G06K9/62 ,  G01R31/265

Abstract: One or more semiconductor wafers or portions thereof are scanned using a primary optical mode, to identify defects. A plurality of the identified defects, including defects of a first class and defects of a second class, are selected and reviewed using an electron microscope. Based on this review, respective defects of the plurality are classified as defects of either the first class or the second class. The plurality of the identified defects is imaged using a plurality of secondary optical modes. One or more of the secondary optical modes are selected for use in conjunction with the primary optical mode, based on results of the scanning using the primary optical mode and the imaging using the plurality of secondary optical modes. Production semiconductor wafers are scanned for defects using the primary optical mode and the one or more selected secondary optical modes.