Optical-mode selection for multi-mode semiconductor inspection

    公开(公告)号:US11010885B2

    公开(公告)日:2021-05-18

    申请号:US16406374

    申请日:2019-05-08

    摘要: One or more semiconductor wafers or portions thereof are scanned using a primary optical mode, to identify defects. A plurality of the identified defects, including defects of a first class and defects of a second class, are selected and reviewed using an electron microscope. Based on this review, respective defects of the plurality are classified as defects of either the first class or the second class. The plurality of the identified defects is imaged using a plurality of secondary optical modes. One or more of the secondary optical modes are selected for use in conjunction with the primary optical mode, based on results of the scanning using the primary optical mode and the imaging using the plurality of secondary optical modes. Production semiconductor wafers are scanned for defects using the primary optical mode and the one or more selected secondary optical modes.

    Adaptive local threshold and color filtering

    公开(公告)号:US09704234B2

    公开(公告)日:2017-07-11

    申请号:US14450170

    申请日:2014-08-01

    IPC分类号: G06T7/00 G06T7/90

    摘要: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.

    Defect Detection Using Structural Information
    3.
    发明申请
    Defect Detection Using Structural Information 有权
    使用结构信息的缺陷检测

    公开(公告)号:US20160104600A1

    公开(公告)日:2016-04-14

    申请号:US14880187

    申请日:2015-10-09

    IPC分类号: H01J37/28

    摘要: Systems and methods for detecting defects on a specimen based on structural information are provided. One system includes one or more computer subsystems configured for separating the output generated by a detector of an inspection subsystem in an array area on a specimen into at least first and second segments of the output based on characteristic(s) of structure(s) in the array area such that the output in different segments has been generated in different locations in the array area in which the structure(s) having different values of the characteristic(s) are formed. The computer subsystem(s) are also configured for detecting defects on the specimen by applying one or more defect detection methods to the output based on whether the output is in the first segment or the second segment.

    摘要翻译: 提供了基于结构信息检测样本上的缺陷的系统和方法。 一个系统包括一个或多个计算机子系统,其被配置为基于检测子系统的检测器产生的输出,以将样本上的阵列区域中的输出的至少第一和第二段基于 阵列区域使得不同段中的输出已经在其中形成具有不同特征值的结构的阵列区域中的不同位置中生成。 计算机子系统还被配置为基于输出是在第一段还是第二段中,通过向输出应用一个或多个缺陷检测方法来检测样本上的缺陷。

    Method and system for correlating optical images with scanning electron microscopy images

    公开(公告)号:US10410338B2

    公开(公告)日:2019-09-10

    申请号:US14506407

    申请日:2014-10-03

    摘要: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.

    Determining a position of a defect in an electron beam image

    公开(公告)号:US10211025B2

    公开(公告)日:2019-02-19

    申请号:US15233971

    申请日:2016-08-11

    摘要: Methods and systems for determining a position of a defect in an electron beam image of a wafer are provided. One method includes determining a second position of a defect with respect to patterns imaged in a test image based on a first position of the defect in a difference image. The method also includes determining a third position of the defect with respect to the patterns in an electron beam image for the defect and determining an association between the first and third positions. In addition, the method includes determining a position of another defect in an electron beam image based on a first position of the other defect in a difference image and the determined association.

    Inspection for specimens with extensive die to die process variation

    公开(公告)号:US10151706B1

    公开(公告)日:2018-12-11

    申请号:US15481421

    申请日:2017-04-06

    IPC分类号: G01N21/95 G01N21/88

    摘要: Methods and systems for detecting defects on a specimen are provided. One method includes identifying first and second portions of dies on a specimen as edge dies and center dies, respectively. The method also includes determining first and second inspection methods for the first and second portions, respectively. Parameter(s) of comparisons performed in the first and second inspection methods are different. The method further includes detecting defects in at least one of the edge dies using the first inspection method and detecting defects in at least one of the center dies using the second inspection method.

    Method and System for Correlating Optical Images with Scanning Electron Microscopy Images
    8.
    发明申请
    Method and System for Correlating Optical Images with Scanning Electron Microscopy Images 审中-公开
    将光学图像与扫描电子显微镜图像相关联的方法和系统

    公开(公告)号:US20150125065A1

    公开(公告)日:2015-05-07

    申请号:US14506407

    申请日:2014-10-03

    IPC分类号: G06T7/00 G06T5/00

    摘要: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.

    摘要翻译: 光学图像与SEM图像的相关性包括通过用光学检查子系统扫描样本来获取样品的全部光学图像,存储全部光学图像,识别存在于全光学中的感兴趣特征的位置 具有附加源的图像,使用SEM工具获取包括所述特征的所述特征的一部分的SEM图像,获取由所述附加源识别的位置处的光学图像部分,所述图像部分包括参考结构 ,基于图像部分和SEM图像两者中感兴趣特征和参考结构的存在,将图像部分和SEM图像相关联,并将感兴趣特征的位置转移到SEM图像中 全光学图像的图像部分的坐标系,以形成校正的光学图像。

    Method and system for correlating optical images with scanning electron microscopy images

    公开(公告)号:US11244442B2

    公开(公告)日:2022-02-08

    申请号:US16508778

    申请日:2019-07-11

    摘要: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.

    Visual feedback for inspection algorithms and filters

    公开(公告)号:US10599944B2

    公开(公告)日:2020-03-24

    申请号:US13685808

    申请日:2012-11-27

    摘要: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.