公开(公告)号：US20190302734A1

公开(公告)日：2019-10-03

申请号：US16254951

申请日：2019-01-23

Applicant: KLA-Tencor Corporation

Inventor： Shivam Agarwal ,  Hariharasudhan Koteeswaran ,  Priyank Jain ,  Suvi Murugan ,  Yuan Zhong

IPC: G05B19/4097 ,  G05B13/02

Abstract: A system includes a controller with processors configured to execute an auto-correlation module embodied in one or more sets of program instructions stored in memory. The auto-correlation module is configured to cause the processors to receive one or more patterned wafer geometry metrics, receive wafer characterization data from one or more characterization tools, determine a correlation between the one or more patterned wafer geometry metrics and the wafer characterization data, generate a ranking of the one or more patterned wafer geometry metrics based on the determined correlation, construct a composite metric model from a subset of the one or more patterned wafer geometry metrics based on the ranking of the one or more patterned wafer geometry metrics, generate one or more composite wafer metrics from the composite metric model, and generate a statistical process control output based on the one or more composite wafer metrics.

公开(公告)号：US11454949B2

公开(公告)日：2022-09-27

申请号：US16254951

申请日：2019-01-23

Applicant: KLA-Tencor Corporation

Inventor： Shivam Agarwal ,  Hariharasudhan Koteeswaran ,  Priyank Jain ,  Suvi Murugan ,  Yuan Zhong

IPC: G05B19/4097 ,  G05B13/02

Abstract: A system includes a controller with processors configured to execute an auto-correlation module embodied in one or more sets of program instructions stored in memory. The auto-correlation module is configured to cause the processors to receive one or more patterned wafer geometry metrics, receive wafer characterization data from one or more characterization tools, determine a correlation between the one or more patterned wafer geometry metrics and the wafer characterization data, generate a ranking of the one or more patterned wafer geometry metrics based on the determined correlation, construct a composite metric model from a subset of the one or more patterned wafer geometry metrics based on the ranking of the one or more patterned wafer geometry metrics, generate one or more composite wafer metrics from the composite metric model, and generate a statistical process control output based on the one or more composite wafer metrics.