公开(公告)号：US20170270652A1

公开(公告)日：2017-09-21

申请号：US15221542

申请日：2016-07-27

Applicant: KLA-Tencor Corporation

Inventor： Tong Huang ,  Xuguang Jiang ,  Yong Zhang

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/20224 ,  G06T2207/30148

Abstract: A system, method, and computer program product are provided for identifying fabricated component defects using a local adaptive threshold. In use, images are received for target and reference components of a fabricated device. Additionally, a difference image is generated from the target and reference component images, and defect candidates for the target component are identified from the difference image. Further, for each of the identified defect candidates at a location in the difference image: a threshold is determined based on a local area surrounding the location of the defect candidate, and a signal at the location of the defect candidate is compared to the threshold to determine whether the defect candidate is a defect.

公开(公告)号：US09008410B2

公开(公告)日：2015-04-14

申请号：US13801135

申请日：2013-03-13

Applicant: KLA-Tencor Corporation

Inventor： Tong Huang

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/30148

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with a dark field inspection system. The method also includes generating first image data for the wafer using the output and a first cell size and second image data for the wafer using the output and a second cell size. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过用暗场检查系统扫描晶片来产生晶片的输出。 该方法还包括使用输出产生用于晶片的第一图像数据，以及使用输出和第二单元尺寸为晶片生成第一单元大小和第二图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

公开(公告)号：US10043265B2

公开(公告)日：2018-08-07

申请号：US15221542

申请日：2016-07-27

Applicant: KLA-Tencor Corporation

Inventor： Tong Huang ,  Xuguang Jiang ,  Yong Zhang

IPC: G06T7/00

Abstract: A system, method, and computer program product are provided for identifying fabricated component defects using a local adaptive threshold. In use, images are received for target and reference components of a fabricated device. Additionally, a difference image is generated from the target and reference component images, and defect candidates for the target component are identified from the difference image. Further, for each of the identified defect candidates at a location in the difference image: a threshold is determined based on a local area surrounding the location of the defect candidate, and a signal at the location of the defect candidate is compared to the threshold to determine whether the defect candidate is a defect.

公开(公告)号：US20140270475A1

公开(公告)日：2014-09-18

申请号：US13801135

申请日：2013-03-13

Applicant: KLA-TENCOR CORPORATION

Inventor： Tong Huang

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/30148

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with a dark field inspection system. The method also includes generating first image data for the wafer using the output and a first cell size and second image data for the wafer using the output and a second cell size. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过用暗场检查系统扫描晶片来产生晶片的输出。 该方法还包括使用输出产生用于晶片的第一图像数据，以及使用输出和第二单元尺寸为晶片生成第一单元大小和第二图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。