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公开(公告)号:US20220276105A1
公开(公告)日:2022-09-01
申请号:US17753198
申请日:2020-08-19
Applicant: KOA Corporation , NTN Corporation
Inventor: Homare KANEKO , Natsumi SHIOBARA , Koichi URANO , Yusuke SHIBUYA , Daichi KONDOU
IPC: G01L1/22
Abstract: A load sensor element includes a substrate made of a ceramic material; an inorganic layer having a surface configured to receive a load, the inorganic layer covers a portion of the substrate; a thin-layer resistance body whose resistance value changes in accordance with the load received by the inorganic layer, the thin-layer resistance body having a main body portion and a pair of end portions, the main body portion mounted on the covered portion of the substrate and sandwiched between the substrate and the inorganic layer, the pair of end portions mounted on an exposed portion of the substrate, and the exposed portion free of the inorganic layer; and a pair of electrodes electrically connected to the pair of end portions of the thin-layer resistance body and separated away from the inorganic layer and on one side of the substrate.
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公开(公告)号:US20210335524A1
公开(公告)日:2021-10-28
申请号:US17278130
申请日:2019-09-17
Applicant: KOA CORPORATION
Inventor: Homare KANEKO , Natsumi SHIOBARA , Yasushi HIROSHIMA
Abstract: A strain sensor resistor includes: a resistive element (thin-film strain-resistive layer) formed nearly at the center of an upper surface of an insulation substrate to be a base; and front surface electrodes layered and formed on either end part of the resistive element and electrically connected to the resistive element. The entire upper part of the resistive element and a part of the front surface electrodes are covered by a protective film (protective coating). Moreover, back surface electrodes electrically connected to the front surface electrodes are formed on either lower end part of the insulation substrate, and end surface electrodes are formed on either longitudinal end surface of the insulation substrate. The strain sensor resistor has a tip shape solder mountable on a circuit board etc. using the back surface electrodes.
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