公开(公告)号：US10969408B2

公开(公告)日：2021-04-06

申请号：US16313366

申请日：2017-05-25

Applicant: KOA CORPORATION

Inventor： Soya Miyajima ,  Ryo Osawa ,  Yoji Kobayashi

IPC: G01R31/02 ,  G01R15/14 ,  H01C1/144 ,  H01C13/00 ,  G01R15/00 ,  G01R1/20 ,  G01R19/00

Abstract: Provided is a current measuring device for measuring current, including a conductor adapted to pass current therethrough, at least a pair of voltage sensing terminals arranged apart from each other on the conductor in the current flowing direction, and a substrate to which the voltage sensing terminals are connected. The substrate is long in the current flowing direction, and connection portion of the substrate that are connected to the voltage sensing terminals are arranged closer to one end side of the substrate in the lengthwise direction.

公开(公告)号：US20200243228A1

公开(公告)日：2020-07-30

申请号：US16634945

申请日：2018-07-11

Applicant: KOA CORPORATION

Inventor： Soya Miyajima ,  Keishi Nakamura

IPC: H01C17/07 ,  H01C17/28 ,  B23K20/02 ,  G01R19/00

Abstract: Provided is a method for manufacturing a current detection resistor, which can prevent uneven-shaped weld trace from generating on a surface close to the bonded surface between the electrode metal and the resistor metal body in a current detection resistor in which electrode metals are bonded to both ends of the resistor metal body. The method includes preparing electrode metals and a resistor metal; stacking the electrode metal, the resistor metal, and the electrode metal, and applying pressure from the stacked direction to form an integrated resistor base material; applying pressure to the resistor base material from a direction perpendicular to the stacked direction to make the resistor base material a thin plate-shape resistor base material; and, obtaining individual resistors from the thin plate-shape resistor base material. The resistor base material is preferably formed by using a hot pressure bonding process.