公开(公告)号：US20170301439A1

公开(公告)日：2017-10-19

申请号：US15516025

申请日：2015-07-22

Applicant: KOA Corporation

Inventor： Naoto OKA ,  Homare SASAKI

IPC: H01C17/242 ,  H01C17/00 ,  B23K26/351

CPC classification number: H01C17/242 ,  B23K26/351 ,  H01C17/006

Abstract: The invention is to provide a resistor trimming method capable of adjusting a resistance value with ultrahigh precision and having excellent production efficiency. To achieve the object, a start point (S1) at a distance from a resistor (4) is irradiated with laser light while probes are brought into contact with a pair of surface electrodes (3) to measure a resistance value of the resistor (4). The place irradiated with the laser light is scanned so that a first trimming groove (5) extending in a direction perpendicular to a current direction can be formed in the resistor (4). Then, the place irradiated with the laser light is returned by a predetermined amount from an end point (first turning point (T1)) of the first trimming groove (5) to be set as a second turning point (T2). With the second turning point (T2) as a start point, scanning and cutting is performed to forma second trimming groove (6). Thus, the resistance value of the resistor (4) is adjusted to a target resistance value with high precision.

公开(公告)号：US20220399143A1

公开(公告)日：2022-12-15

申请号：US17828276

申请日：2022-05-31

Applicant: KOA CORPORATION

Inventor： Naoto OKA

IPC: H01C17/00 ,  H01C1/142 ,  H01C7/00

Abstract: Resistive elements are formed in belt shape in regions sandwiched between secondary division prediction lines set onto a large substrate and extending in a direction orthogonal to primary division prediction lines, a plurality of front electrodes disposed facing each other at predetermined intervals on the resistive elements are formed so as to be across the primary division prediction lines, a glass coat layer covering each of the resistive elements and extending in the direction orthogonal to the secondary division prediction lines is formed, a resin coat layer covering an entire surface of the large substrate from a top of the glass coat layer is formed, and after that, the large substrate is diced along the primary division prediction lines and the secondary division prediction lines to obtain individual chip base bodies.

公开(公告)号：US20220399140A1

公开(公告)日：2022-12-15

申请号：US17752200

申请日：2022-05-24

Applicant: KOA CORPORATION

Inventor： Naoto OKA

IPC: H01C7/00 ,  H01C1/142

Abstract: A chip resistor including: a rectangular parallelepiped insulating substrate; a strip-shaped resistor; a pair of front electrodes formed on a front surface of the resistor at both ends in the longitudinal direction; an insulating protective layer; and a pair of end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, each of which is connected to each end face of the resistor, corresponding one of the front electrodes, and protective film; and a pair of external electrodes, wherein a cross-sectional shape of each of the front electrodes is almost a triangle in which a side of the end face has a maximum height, and a shape of an end face of each of the end face electrodes is almost a square.