公开(公告)号：US11421081B2

公开(公告)日：2022-08-23

申请号：US17187055

申请日：2021-02-26

Applicant: KOLON INDUSTRIES, INC.

Inventor： Doo Li Choi ,  Hak Gee Jung

IPC: C08G73/22 ,  C08J5/18 ,  C08G73/10 ,  C08G61/12 ,  C08L79/08

Abstract: A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.