Abstract:
The present invention relates to a polyamic acid solution and a display device, and more specifically, to a polyamic acid solution which can be used for a base layer or a protective layer of a display device, and a display device including a film formed by the imidization of the polyamic acid solution. The polyamic acid solution has excellent thermal characteristics such as a low coefficient of thermal expansion and a high thermal decomposition temperature, and can thus be applied to a base layer or a protective layer of a display device.
Abstract:
This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).
Abstract:
The present invention relates to a polyamic acid solution, an imidization film, and a display device, and discloses a polyamic acid solution which is a reaction product of dianhydrides and aromatic diamines and has a thermal expansion coefficient of 10 ppm/° C. or less in a temperature range of 50 to 540° C., after forming an imidization film, an imidization film thereof, and a display device including the same. The present invention may provide a display having excellent thermal stability, proper flexibility, and mechanical strength by applying the polyamic acid solution.