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1.发明申请ULTRASOUND TRANSDUCER ASSEMBLY AND METHOD FOR MANUFACTURING AN ULTRASOUND TRANSDUCER ASSEMBLY 审中-公开超声波传感器总成及制造超声波传感器总成的方法公开(公告)号：US20170008030A1
公开(公告)日：2017-01-12
申请号：US15117848
申请日：2015-03-02
Applicant: KONINKLIJKE PHILIPS N.V. , TECHNISCHE UNIVERSITEIT DELF
Inventor： Ronald Dekker , Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Maria Filomena Raganato
CPC classification number: B06B1/0292 , A61B8/12 , A61B8/445 , A61B8/4494 , G01N29/2406 , G01N2291/101
Abstract: The present invention relates to an ultrasound transducer assembly (10), in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element (30) including an ultrasound transducer element (14) for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface (44), a bottom surface (46) and a side surface connecting the top surface and the bottom surface. An isolation layer (32, 50) forms the side surface for electrically isolating the substrate element.
Abstract translation: 本发明涉及超声换能器组件（10），特别是涉及血管内超声系统。 超声换能器组件包括至少一个硅衬底元件（30），其包括用于发射和接收超声波的超声换能器元件（14），并且包括用于电连接换能器元件的电连接器。 衬底元件具有顶表面（44），底表面（46）和连接顶表面和底表面的侧表面。 隔离层（32,50）形成用于电绝缘衬底元件的侧表面。
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2.发明授权公开(公告)号：US10898925B2
公开(公告)日：2021-01-26
申请号：US16268942
申请日：2019-02-06
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Ronald Dekker , Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Maria Filomena Raganato
Abstract: The present invention relates to an ultrasound transducer assembly, in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element including an ultrasound transducer element for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface. An isolation layer forms the side surface for electrically isolating the substrate element.
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3.发明申请公开(公告)号：US20190224717A1
公开(公告)日：2019-07-25
申请号：US16268942
申请日：2019-02-06
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Ronald Dekker , Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Maria Filomena Raganato
Abstract: The present invention relates to an ultrasound transducer assembly, in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element including an ultrasound transducer element for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface. An isolation layer forms the side surface for electrically isolating the substrate element.
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4.发明授权公开(公告)号：US10239093B2
公开(公告)日：2019-03-26
申请号：US15117848
申请日：2015-03-02
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Ronald Dekker , Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Maria Filomena Raganato
Abstract: The present invention relates to an ultrasound transducer assembly (10), in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element (30) including an ultrasound transducer element (14) for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface (44), a bottom surface (46) and a side surface connecting the top surface and the bottom surface. An isolation layer (32, 50) forms the side surface for electrically isolating the substrate element.
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