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1.发明授权公开(公告)号：US09534949B2
公开(公告)日：2017-01-03
申请号：US14349077
申请日：2012-10-26
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Peter Dirksen , Ronald Dekker , Vincent Adrianus Henneken , Adriaan Leeuwestein , Bout Marcelis , John Douglas Fraser
CPC classification number: G01H9/008 , B06B1/0292 , Y10T29/49005
Abstract: The present invention relates to a pre-collapsed capacitive micro-machined transducer cell (10) comprising a substrate (12), and a membrane (14) disposed above a total membrane area (Atotal), wherein a cavity (20) is formed between the membrane (14) and the substrate (12), the membrane comprising a hole (15) and an edge portion (14a) surrounding the hole (15). The cell (10) further comprises a stress layer (17) on the membrane (14), the stress layer (17) having a predetermined stress value with respect to the membrane (14), the stress layer (17) being adapted to provide a bending moment on the membrane (14) in a direction towards the substrate (12) such that the edge portion (14a) of the membrane (14) is collapsed to the substrate (12). The present invention further relates to a method of manufacturing such pre-collapsed capacitive micro-machined transducer cell (10).
Abstract translation: 本发明涉及一种包括基底（12）的预折叠电容微加工的换能器单元（10）和设置在总膜面积（Atotal）之上的隔膜（14），其中，腔 所述膜（14）和所述基板（12），所述膜包括孔（15）和围绕所述孔（15）的边缘部分（14a）。 电池（10）还包括膜（14）上的应力层（17），应力层（17）相对于膜（14）具有预定的应力值，应力层（17）适于提供 在所述膜（14）上朝向所述基板（12）的方向上的弯曲力矩使得所述膜（14）的边缘部分（14a）折叠到所述基板（12）。 本发明还涉及一种制造这种预塌缩的电容微加工的换能器单元（10）的方法。
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公开(公告)号：US09230908B2
公开(公告)日：2016-01-05
申请号：US14346824
申请日：2012-10-12
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Ronald Dekker , Marcelis Bout , Marcel Mulder , Ruediger Mauczok
IPC: H01L23/00 , H01L23/522 , H01L21/768 , H01L23/48 , B06B1/02 , H01L23/532
CPC classification number: H01L23/5226 , B06B1/0292 , H01L21/76898 , H01L23/481 , H01L23/53271 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/13024 , H01L2224/131 , H01L2224/16145 , H01L2924/1461 , H01L2924/014 , H01L2924/00
Abstract: The present invention relates to a through-wafer via device (10) comprising a wafer (12) made of a wafer material and having a first wafer surface (12a) and a second wafer surface (12b) opposing the first wafer surface (12a). The through-wafer via device (10) further comprises a plurality of side by side first trenches (14) provided with a conductive material and extending from the first wafer surface (12a) into the wafer (12) such that a plurality of spacers (16) of the wafer material are formed between the first trenches (14). The through-wafer via device (10) further comprises a second trench (18) provided with the conductive material and extending from the second wafer surface (12b) into the wafer (12), the second trench (18) being connected to the first trenches (14). The through-wafer via device (10) further comprises a conductive layer (20) made of the conductive material and formed on the side of the first wafer surface (12a), the conductive material filling the first trenches (14) such that the first conductive layer (20) has a substantially planar and closed surface.
Abstract translation: 本发明涉及包括由晶片材料制成并具有与第一晶片表面（12a）相对的第一晶片表面（12a）和第二晶片表面（12b）的晶片（12）的贯通晶片通孔装置（10） 。 贯通晶片通孔装置（10）还包括设置有导电材料并从第一晶片表面（12a）延伸到晶片（12）中的多个并排的第一沟槽（14），使得多个间隔件 在第一沟槽（14）之间形成晶片材料。 贯通晶片通孔装置（10）还包括设置有导电材料并从第二晶片表面（12b）延伸到晶片（12）中的第二沟槽（18），第二沟槽（18）连接到第一 沟槽（14）。 贯通晶片通孔装置（10）还包括由导电材料制成并形成在第一晶片表面（12a）一侧上的导电层（20），该导电材料填充第一沟槽（14），使得第一 导电层（20）具有基本平坦和闭合的表面。
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公开(公告)号：US09117438B2
公开(公告)日：2015-08-25
申请号：US14349079
申请日：2012-10-15
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Peter Dirksen , Ronald Dekker , Vincent Adrianus Henneken , Adriaan Leeuwestein , Bout Marcelis , John Douglas Fraser
CPC classification number: G10K11/18 , B06B1/0292 , H04R31/00 , Y10T29/49005
Abstract: The present invention relates to a pre-collapsed capacitive micro-machined transducer cell (10) comprising a substrate (12), and a membrane (14) disposed above a total membrane area ((Atotal), wherein a cavity (20) is formed between the membrane (14) and the substrate (12), the membrane (14) comprising a hole (15) and an edge portion (14a) surrounding the hole (15), the edge portion (14a) of the membrane (14) being collapsed to the substrate (12). The cell further comprises a plug (30) arranged in the hole (15) of the membrane (14), the plug (30) being located only in a subarea (Asub) of the total membrane area (Atotal). The present invention further relates to a method of manufacturing such pre-collapsed capacitive micro-machined transducer cell (10).
Abstract translation: 本发明涉及一种包括基底（12）的预折叠电容微加工换能器单元（10），以及设置在总膜面积（（Atotal））之上的膜（14），其中形成空腔 在膜（14）和基板（12）之间，膜（14）包括孔（15）和围绕孔（15）的边缘部分（14a），膜（14）的边缘部分（14a） 所述电池还包括布置在所述膜（14）的孔（15）中的插塞（30），所述插塞（30）仅位于所述膜（14）的子区域（Asub）中， 区域（Atotal）。本发明还涉及一种制造这种预塌缩的电容微加工的换能器单元（10）的方法。
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公开(公告)号：US20140247698A1
公开(公告)日：2014-09-04
申请号：US14349079
申请日：2012-10-15
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Peter Dirksen , Ronald Dekker , Vincent Adrianus Henneken , Adriaan Leeuwestein , Bout Marcelis , John Douglas Fraser
CPC classification number: G10K11/18 , B06B1/0292 , H04R31/00 , Y10T29/49005
Abstract: The present invention relates to a pre-collapsed capacitive micro-machined transducer cell (10) comprising a substrate (12), and a membrane (14) disposed above a total membrane area ((Atotal), wherein a cavity (20) is formed between the membrane (14) and the substrate (12), the membrane (14) comprising a hole (15) and an edge portion (14a) surrounding the hole (15), the edge portion (14a) of the membrane (14) being collapsed to the substrate (12). The cell further comprises a plug (30) arranged in the hole (15) of the membrane (14), the plug (30) being located only in a subarea (Asub) of the total membrane area (Atotal). The present invention further relates to a method of manufacturing such pre-collapsed capacitive micro-machined transducer cell (10).
Abstract translation: 本发明涉及一种包括基底（12）的预折叠电容微加工换能器单元（10），以及设置在总膜面积（（Atotal））之上的膜（14），其中形成空腔（20） 在膜（14）和基板（12）之间，膜（14）包括孔（15）和围绕孔（15）的边缘部分（14a），膜（14）的边缘部分（14a） 所述电池还包括布置在所述膜（14）的孔（15）中的插塞（30），所述插塞（30）仅位于所述膜（14）的子区域（Asub）中， 区域（Atotal）。本发明还涉及一种制造这种预塌缩的电容微加工的换能器单元（10）的方法。
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公开(公告)号：US11957508B2
公开(公告)日：2024-04-16
申请号：US16768849
申请日：2018-12-10
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Egbertus Reinier Jacobs , Johannes Wilhelmus Weekemp , Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Ronald Dekker
CPC classification number: A61B8/12 , A61B8/445 , A61B8/4477 , A61B8/4494 , A61B8/54 , A61B8/4488
Abstract: Devices, systems, and methods relating to intraluminal imaging are disclosed. In an embodiment, an intraluminal imaging device is disclosed. One embodiment of the intraluminal imaging device comprises a flexible elongate member configured to be inserted into a body lumen of a patient, the flexible elongate member comprising a proximal portion and a distal portion. The intraluminal imaging device further comprises an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The imaging assembly comprises a support member, a flexible substrate positioned around the support member, a plurality of ultrasound transducer elements integrated in the flexible substrate, and a plurality of control circuits disposed on the flexible substrate at a position proximal to the plurality of transducer elements. The plurality of control circuits has an outer profile that does not extend beyond an outer profile of the plurality of transducer elements.
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Patent Agency Ranking
公开(公告)号：US11413008B2
公开(公告)日：2022-08-16
申请号：US16622416
申请日：2018-06-26
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Ronald Dekker , Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Aslihan Arslan Carisey
Abstract: An intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient. The flexible elongate member includes a proximal portion and a distal portion. The device also includes an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The ultrasound imaging assembly is configured to obtain imaging data of the body lumen. The ultrasound imaging assembly includes a transducer array including a substrate, a silicon oxide layer disposed over the substrate, and a plurality of rows of micromachined ultrasound transducer elements disposed on the silicon oxide layer. Two of the plurality of rows of micromachined ultrasound transducer elements are spaced apart by a trench formed by etching through a screen formed in the silicon oxide layer. Associated devices, systems, and methods are also provided.
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7.发明授权公开(公告)号：US11407008B2
公开(公告)日：2022-08-09
申请号：US14913402
申请日：2014-08-14
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Ronald Dekker , Vincent Adrianus Henneken
Abstract: The present invention relates to an ultrasound transducer assembly (10), in particular for intra vascular ultrasound systems. The assembly (10) comprises a transducer array (12) including a plurality of transducer elements (14) for transmitting and receiving ultrasound waves. Two support elements (16, 18) are provided for supporting the transducer array (12) in a curved or polygonal shape. The support elements (16, 18) are connected via a flexible connection layer (20) to the transducer array (12) for flexibly connecting the support elements (16, 18) to the transducer array (12).
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公开(公告)号：US10898924B2
公开(公告)日：2021-01-26
申请号：US15325492
申请日：2015-07-13
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Wojtek Sudol , Peter Dirksen , Vincent Adrianus Henneken , Ronald Dekker , Marcus Cornelis Louwerse
Abstract: A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.
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公开(公告)号：US10828673B2
公开(公告)日：2020-11-10
申请号：US15326055
申请日：2015-06-25
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Johannes Wilhelmus Weekamp , Ronald Dekker , Marc Godfriedus Marie Notten , Antonia Cornelia Jeannet Van Rens
Abstract: An ultrasound transducer arrangement (100) is disclosed comprising a plurality of substrate islands (110, 120, 130) spatially separated and electrically interconnected by a flexible polymer assembly (150) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island (110) comprising a plurality of ultra sound transducer cells (112) and a second substrate island (120) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly (200) comprising a plurality of coaxial wires (220) each having a conductive core (228) covered by an electrically insulating sleeve (226); and an electrically insulating body (210) having a first main surface (211), a second main surface (213) and a plurality of through holes (212) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump (214) on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB.
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10.发明申请公开(公告)号：US20190224717A1
公开(公告)日：2019-07-25
申请号：US16268942
申请日：2019-02-06
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Ronald Dekker , Vincent Adrianus Henneken , Marcus Cornelis Louwerse , Maria Filomena Raganato
Abstract: The present invention relates to an ultrasound transducer assembly, in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element including an ultrasound transducer element for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface. An isolation layer forms the side surface for electrically isolating the substrate element.
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