公开(公告)号：US20200274222A1

公开(公告)日：2020-08-27

申请号：US16874213

申请日：2020-05-14

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Hyeon Min BAE ,  Ha II SONG ,  Huxian JIN

IPC: H01P5/08 ,  H01P3/08 ,  H01P3/16 ,  H01P1/00

Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

公开(公告)号：US20170141450A1

公开(公告)日：2017-05-18

申请号：US15342551

申请日：2016-11-03

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyeon Min BAE ,  Ha II SONG ,  HuXian JIN ,  Joon Yeong LEE ,  Hyo Sup WON ,  Tae Hoon YOON

IPC: H01P5/107 ,  H01P3/16 ,  H01P5/08 ,  H01P3/08

CPC classification number: H01P5/087 ,  H01P3/081 ,  H01P3/122 ,  H01P3/16 ,  H01P5/107

Abstract: The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.